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SN74AS897AGB

Texas Instruments

SN74AS897AGB by Texas Instruments

SN74AS897AGB by Texas Instruments is a DSP peripheral with 16-bit output data bus width and CMOS technology. It operates b/w 0-70°C, suitable for commercial applications requiring high-speed data processing. The package style is grid array, with a square shape and dimensions of 27.9mm x 27.9mm x 4.57mm, making it ideal for compact designs in various electronic systems.

Median Price

$106.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 3 parts In-Stock

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$106.260

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Vyrian

USA . 5,725 parts In-Stock

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5,725

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Digiode

USA . 1,308 parts In-Stock

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Semtec, LLC

USA . 15 parts In-Stock

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Electronic Expediters

USA . 11 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 859 parts In-Stock

1+ parts

$14.000

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859

$14.000

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AZTECH Wire

Italy . 594 parts In-Stock

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$15.845

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594

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Parana Technologies

USA . 2,368 parts In-Stock

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$29.945

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$65.068

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2,368

$29.945

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$65.068

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DigiPath Technology Company

USA . 1,988 parts In-Stock

1+ parts

$32.973

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$30.335

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$32.973

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IDEA Electronic Components Group

UK . 1,232 parts In-Stock

1+ parts

$33.646

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$31.964

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$30.281

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1,232

$33.646

$31.964

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ChromeModa Solutions

Germany . 201 parts In-Stock

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$33.646

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$27.590

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201

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$27.590

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Corohmni

South Africa . 636 parts In-Stock

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$40.667

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Corphita

USA . 4,732 parts In-Stock

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Assy Fe

Spain . 8 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the Texas Instruments SN74AS897AGB. Crafted with precision and expertise, this DSP peripheral offers unparalleled performance and reliability. Ideal for a wide range of applications, this product delivers seamless data transmission and processing capabilities. Experience enhanced efficiency and productivity with the innovative features of this high-quality component. Elevate your projects to new heights with the Texas Instruments SN74AS897AGB.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures durability and reliable performance in various environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for flexibility in power supply options and compatibility with different systems.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and making it suitable for applications where size constraints are present.

Output Data Bus Width: 16

The 16-bit output data bus width allows for fast and efficient data processing, making this product ideal for high-performance applications.

No. of Terminals: 68

With 68 terminals, this product offers sufficient connectivity options for interfacing with other components and peripherals in a system.

Package Style (Meter): GRID ARRAY

The grid array package style provides enhanced thermal performance and reliability, making it suitable for demanding applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V ensures efficient power consumption and extends the product's operating range.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable operation even in cold conditions, making it suitable for a wide range of applications.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy installation and connection, simplifying the integration of this product into a system.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57 mm allows for a low-profile design, making it suitable for applications with height restrictions.

Width: 27.9 mm

With a width of 27.9 mm, this product offers a compact form factor while still providing enough space for circuitry and components.

External Data Bus Width: 16

The 16-bit external data bus width facilitates high-speed data transfer between this product and external devices, enhancing overall system performance.

Length: 27.9 mm

With a length of 27.9 mm, this product offers a balanced form factor that fits well in various system designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance within standard temperature ranges, making it suitable for typical commercial applications.

Peripheral IC Type: DSP PERIPHERAL, BARREL SHIFTER

The inclusion of a DSP peripheral and barrel shifter enhances the product's data processing capabilities, making it suitable for signal processing and computational tasks.

Technology: CMOS

The CMOS technology offers low power consumption and fast operation, making this product energy-efficient and suitable for battery-powered devices.

Terminal Form: PIN/PEG

The pin/peg terminal form provides a secure and reliable connection interface, ensuring stable operation and easy integration with other components.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a standard operating voltage for compatibility with various systems and power sources.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm offers convenient spacing for terminals, allowing for easy connection and soldering during assembly.

Technical Specifications

DSP Peripherals SN74AS897AGB attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

16

JESD-30 Code:

S-CPGA-P68

Length:

27.9 mm

Low Power Mode:

NO

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

16

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27.9 mm

Peripheral IC Type:

Trade Compliance

SN74AS897AGB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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