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SN74ALS29819NT3

Texas Instruments

SN74ALS29819NT3 by Texas Instruments

SN74ALS29819NT3 by Texas Instruments is a DSP peripheral IC with 24 terminals in an inline package. It operates b/w 0°C to 70°C, suitable for commercial applications. Featuring TTL technology and pipeline register design, it is ideal for digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,004 parts In-Stock

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2,004

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Digiode

USA . 1,379 parts In-Stock

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1,379

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Distributors (Availability)

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AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$11.410

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798

$11.410

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Corohmni

South Africa . 636 parts In-Stock

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$18.338

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636

$18.338

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One Stop Electronics

USA . 201 parts In-Stock

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$24.000

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201

$24.000

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Parana Technologies

USA . 560 parts In-Stock

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$59.407

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560

$59.407

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DigiPath Technology Company

USA . 441 parts In-Stock

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$65.414

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$60.181

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441

$65.414

$60.181

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ChromeModa Solutions

Germany . 5,086 parts In-Stock

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$66.749

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$54.734

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5,086

$66.749

$54.734

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IDEA Electronic Components Group

UK . 1,768 parts In-Stock

1+ parts

$66.749

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$63.412

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$60.074

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1,768

$66.749

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$60.074

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Corphita

USA . 504 parts In-Stock

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504

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Overview

Discover the power of Texas Instruments with the SN74ALS29819NT3, a top-of-the-line DSP peripheral that guarantees high-quality performance and reliability. This innovative product is designed to enhance a wide range of applications in various industries, providing unmatched value and benefits to customers. Experience superior efficiency and precision with Texas Instruments, a trusted manufacturer known for its cutting-edge technology and commitment to excellence. Elevate your projects with the SN74ALS29819NT3 and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components of the DSP peripheral, ensuring a longer lifespan.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in various electronic systems or applications.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and compatibility with a wide range of devices or circuits.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures functionality in both cold and warm environments, making it suitable for various applications.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved signal integrity, enhancing the overall reliability of the DSP peripheral.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this DSP peripheral is suitable for standard commercial applications, providing a cost-effective solution.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

The DSP peripheral with pipeline register offers high-speed data processing and efficient performance for complex computational tasks.

Technology: TTL

The use of TTL technology ensures compatibility with a wide range of digital systems and devices, making it a versatile choice for integration.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly and soldering process, ensuring a secure and reliable connection in various electronic setups.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch provides ample spacing for connections, reducing the risk of short circuits and facilitating easy installation.

Technical Specifications

DSP Peripherals SN74ALS29819NT3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74ALS29819NT3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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