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SN7480N3

Texas Instruments

SN7480N3 by Texas Instruments

SN7480N3 by Texas Instruments is a DSP peripheral with TTL technology. It features 14 terminals in an in-line rectangular package, operating b/w 0°C to 70°C. Ideal for commercial applications requiring multiplier functions and through-hole terminal form at a pitch of 2.54mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,986 parts In-Stock

1+ parts

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2,986

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Vyrian

USA . 2,759 parts In-Stock

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2,759

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,018 parts In-Stock

1+ parts

$1.000

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1,018

$1.000

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AZTECH Wire

Italy . 837 parts In-Stock

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$8.743

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837

$8.743

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Parana Technologies

USA . 1,309 parts In-Stock

1+ parts

$41.339

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1,309

$41.339

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DigiPath Technology Company

USA . 716 parts In-Stock

1+ parts

$45.519

100+ parts

$41.878

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716

$45.519

$41.878

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ChromeModa Solutions

Germany . 3,617 parts In-Stock

1+ parts

$46.448

100+ parts

$38.087

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3,617

$46.448

$38.087

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IDEA Electronic Components Group

UK . 1,709 parts In-Stock

1+ parts

$46.448

100+ parts

$44.126

1k+ parts

$41.803

10k+ parts

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1,709

$46.448

$44.126

$41.803

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Corohmni

South Africa . 4,899 parts In-Stock

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$71.719

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4,899

$71.719

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Corphita

USA . 3,200 parts In-Stock

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3,200

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Overview

Elevate your DSP projects with the SN7480N3 from Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This versatile DSP peripheral boasts a durable plastic/epoxy package body and 14 terminals in an in-line rectangular shape. Whether you're working on audio processing, image recognition, or telecommunications applications, this multiplier-type IC offers superior performance and reliability. Trust Texas Instruments to provide cutting-edge technology and exceptional value in every product, making your projects shine brighter than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to physical damage, ensuring the longevity of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and circuit layouts.

No. of Terminals: 14

Having 14 terminals provides flexibility and compatibility with different circuit configurations, offering versatility in application.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to install and connect in a linear manner, simplifying the overall design and implementation process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate efficiently in a wide range of environments without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the product can function reliably even in low-temperature conditions.

Terminal Position: DUAL

Dual terminal positions provide redundancy and stability in connection, reducing the risk of signal loss or interruption.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grade ensures that this product is suitable for standard commercial applications with consistent performance.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

The DSP peripheral with a multiplier function enhances the processing capabilities of the product, enabling advanced digital signal processing tasks.

Technology: TTL

Utilizing TTL technology ensures compatibility with a wide range of digital systems and devices, offering seamless integration and reliable operation.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables secure and reliable connection to circuit boards, reducing the risk of disconnection or signal loss.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product is compatible with standard PCB layouts and design guidelines, making it easy to integrate into existing systems.

Technical Specifications

DSP Peripherals SN7480N3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN7480N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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