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SN54AS8838GB

Texas Instruments

SN54AS8838GB by Texas Instruments

SN54AS8838GB by Texas Instruments is a DSP peripheral with 32-bit output data bus width and CMOS technology. Operating in military-grade temperature range of -55 to 125 °C, it features a square package shape and grid array style suitable for various applications requiring high-speed data processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,502 parts In-Stock

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Digiode

USA . 661 parts In-Stock

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AZTECH Wire

Italy . 752 parts In-Stock

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$7.023

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752

$7.023

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One Stop Electronics

USA . 1,442 parts In-Stock

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$8.000

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Corohmni

South Africa . 55 parts In-Stock

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$49.023

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55

$49.023

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Parana Technologies

USA . 98 parts In-Stock

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$52.169

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98

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DigiPath Technology Company

USA . 936 parts In-Stock

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$57.445

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936

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ChromeModa Solutions

Germany . 6,543 parts In-Stock

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$58.617

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$48.066

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IDEA Electronic Components Group

UK . 1,746 parts In-Stock

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$58.617

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$55.686

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$52.755

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$52.755

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Corphita

USA . 3,339 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the SN54AS8838GB by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers cutting-edge DSP peripherals that guarantee superior performance and reliability. Ideal for military-grade applications, this product offers a wide range of features to enhance your projects, from its durable ceramic and metal-sealed co-fired package body material to its versatile 32-bit output data bus width. Let Texas Instruments elevate your work to new heights with the SN54AS8838GB.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides high reliability and durability, making the product suitable for harsh operating conditions.

Maximum Supply Voltage: 5.5 V

The maximum supply voltage of 5.5 V allows for versatile power options and compatibility with various systems.

Package Shape: SQUARE

The square package shape makes integration and placement of the DSP peripherals efficient and space-saving.

Output Data Bus Width: 32

With a wide output data bus width of 32, this product can handle complex data processing tasks efficiently and quickly.

No. of Terminals: 84

The high number of terminals enables connectivity with other system components and peripherals, enhancing the product's functionality.

Package Style (Meter): GRID ARRAY

The grid array package style offers robust mechanical support and facilitates easy soldering, ensuring reliable performance.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures flexibility in power requirements and allows for operation in low-power environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand and perform reliably in demanding thermal conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C extends the product's usability in extreme cold environments without compromising performance.

Terminal Position: PERPENDICULAR

The perpendicular terminal position simplifies installation and connection, improving ease of use and ensuring secure connectivity.

External Data Bus Width: 32

The external data bus width of 32 enhances data transfer speeds and overall system performance, especially for applications requiring high bandwidth.

Temperature Grade: MILITARY

The military-grade temperature rating signifies ruggedness and reliability, making this product suitable for defense and aerospace applications where extreme conditions are prevalent.

Peripheral IC Type: DSP PERIPHERAL, BARREL SHIFTER

The inclusion of a barrel shifter in the DSP peripheral IC type enhances data manipulation capabilities, enabling efficient and advanced signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of systems, making this product energy-efficient and versatile.

Terminal Form: PIN/PEG

The pin/peg terminal form provides reliable connections and easy integration with existing hardware, ensuring seamless operation and minimal installation hassle.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V is standard and widely supported, allowing for easy integration and compatibility across different platforms and devices.

Technical Specifications

DSP Peripherals SN54AS8838GB attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

32

JESD-30 Code:

S-CPGA-P84

Low Power Mode:

NO

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

32

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SN54AS8838GB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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