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SNC54LS261J

Texas Instruments

SNC54LS261J by Texas Instruments

SNC54LS261J by Texas Instruments is a MIL-STD-883 Class B DSP peripheral IC with 16 terminals. It operates b/w -55°C to 125°C, suitable for military applications. This TTL technology multiplier has a ceramic package in an in-line rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,356 parts In-Stock

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Digiode

USA . 1,872 parts In-Stock

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AZTECH Wire

Italy . 652 parts In-Stock

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$4.933

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One Stop Electronics

USA . 203 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,898 parts In-Stock

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$75.937

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Corohmni

South Africa . 984 parts In-Stock

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$76.155

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984

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ChromeModa Solutions

Germany . 1,911 parts In-Stock

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$85.323

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$69.965

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IDEA Electronic Components Group

UK . 753 parts In-Stock

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$85.323

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$81.057

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$76.791

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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$76.927

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Corphita

USA . 297 parts In-Stock

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Overview

Enhance your designs with the exceptional quality of the Texas Instruments SNC54LS261J. As a leader in DSP Peripherals, Texas Instruments delivers top-notch products that excel in performance and reliability. This versatile IC offers a wide range of applications, making it a valuable addition to any project. With advanced technology and military-grade temperature specifications, the SNC54LS261J provides unmatched value and benefits to customers seeking high-quality components for their designs. Trust Texas Instruments for superior products that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and stability, making them ideal for high-performance applications.

Screening Level: MIL-STD-883 Class B (Modified)

Meeting military standard screening ensures high reliability and quality, making it suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easy integration into existing systems.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity and compatibility with various systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature enables reliable performance in demanding environments.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a multiplier DSP peripheral, this product is capable of high-speed mathematical calculations, making it suitable for signal processing applications.

Technology: TTL

TTL technology offers high speed and low power consumption, making it an efficient choice for digital signal processing tasks.

Technical Specifications

DSP Peripherals SNC54LS261J attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNC54LS261J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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