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ADSP-1102TD

Analog Devices

ADSP-1102TD by Analog Devices

Analog Devices' ADSP-1102TD is a DSP Peripheral with 16-bit output data bus width, operating temperature range of -55 to 125°C. Ideal for military applications, this CMOS technology-based IC features a 64-terminal package in an in-line style with tin lead finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,961 parts In-Stock

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Digiode

USA . 464 parts In-Stock

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464

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Native Components

USA . 744 parts In-Stock

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$1.600

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744

$1.600

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Northwest PG Solutions

USA . 691 parts In-Stock

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$1.760

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691

$1.760

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AZTECH Wire

Italy . 542 parts In-Stock

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$5.034

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542

$5.034

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One Stop Electronics

USA . 662 parts In-Stock

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$31.000

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662

$31.000

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Semicontronic

India . 333 parts In-Stock

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$33.000

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$32.175

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$32.010

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333

$33.000

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$32.010

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Parana Technologies

USA . 250 parts In-Stock

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$75.648

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$70.353

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250

$75.648

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$70.353

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Corohmni

South Africa . 944 parts In-Stock

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$80.614

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944

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IDEA Electronic Components Group

UK . 1,940 parts In-Stock

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$81.342

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$77.275

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DigiPath Technology Company

USA . 3,053 parts In-Stock

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$126.894

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$121.818

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$121.818

3,053

$126.894

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$121.818

Corphita

USA . 105 parts In-Stock

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Overview

Unlock the power of advanced signal processing with the ADSP-1102TD by Analog Devices. Designed with precision and reliability in mind, this DSP Peripheral offers unmatched performance and versatility for a wide range of applications. Whether you're looking to optimize audio systems, enhance image processing, or streamline communication networks, this high-quality product delivers exceptional value and efficiency. Trust Analog Devices, a leader in semiconductor technology, to provide cutting-edge solutions that exceed expectations. Elevate your projects with the ADSP-1102TD and experience unparalleled results.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability to the product.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic systems.

Output Data Bus Width: 16

With a 16-bit output data bus width, the product can handle and process data efficiently.

No. of Terminals: 64

The 64 terminals offer versatility in connectivity options for the product.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the product can withstand harsh environmental conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the product compatible with standard power sources.

Technical Specifications

DSP Peripherals ADSP-1102TD attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

Boundary Scan:

NO

External Data Bus Width:

16

JESD-30 Code:

R-CDIP-T64

JESD-609 Code:

e0

Length:

81.28 mm

Low Power Mode:

NO

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

16

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.29 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

22.86 mm

Peripheral IC Type:

Trade Compliance

ADSP-1102TD Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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