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ADSP-1008ASD/+

Analog Devices

ADSP-1008ASD/+ by Analog Devices

DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 10,745 parts In-Stock

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10,745

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Digiode

USA . 364 parts In-Stock

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364

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$12.572

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561

$12.572

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Parana Technologies

USA . 4,746 parts In-Stock

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$17.161

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-

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$15.960

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4,746

$17.161

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$15.960

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IDEA Electronic Components Group

UK . 1,698 parts In-Stock

1+ parts

$18.453

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$17.530

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$17.530

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1,698

$18.453

$17.530

$17.530

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DigiPath Technology Company

USA . 4,746 parts In-Stock

1+ parts

$28.787

100+ parts

$27.635

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$27.635

4,746

$28.787

$27.635

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$27.635

One Stop Electronics

USA . 842 parts In-Stock

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$30.000

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842

$30.000

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Semicontronic

India . 972 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

1k+ parts

$32.010

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972

$33.000

$32.175

$32.010

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Corohmni

South Africa . 175 parts In-Stock

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$68.781

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175

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Northwest PG Solutions

USA . 2,343 parts In-Stock

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2,343

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Native Components

USA . 911 parts In-Stock

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911

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Corphita

USA . 878 parts In-Stock

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878

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Technical Specifications

DSP Peripherals ADSP-1008ASD/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

Boundary Scan:

NO

External Data Bus Width:

8

JESD-30 Code:

R-CDIP-T48

JESD-609 Code:

e0

Length:

60.96 mm

Low Power Mode:

NO

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

19

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP48,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.29 mm

Sub-Category:

DSP Peripherals

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

ADSP-1008ASD/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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