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SNC5480W

Texas Instruments

SNC5480W by Texas Instruments

SNC5480W by Texas Instruments is a MIL-STD-883 Class B (Modified) DSP peripheral with 14 terminals in a ceramic flatpack package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications requiring TTL technology and dual terminal positions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,376 parts In-Stock

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7,376

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Digiode

USA . 1,789 parts In-Stock

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1,789

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Distributors (Availability)

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One Stop Electronics

USA . 1,562 parts In-Stock

1+ parts

$2.000

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1,562

$2.000

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Corohmni

South Africa . 688 parts In-Stock

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$12.991

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688

$12.991

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AZTECH Wire

Italy . 459 parts In-Stock

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$14.711

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459

$14.711

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Parana Technologies

USA . 1,220 parts In-Stock

1+ parts

$16.510

100+ parts

$1,533.158

1k+ parts

$14.859

10k+ parts

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1,220

$16.510

$1,533.158

$14.859

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DigiPath Technology Company

USA . 1,900 parts In-Stock

1+ parts

$18.179

100+ parts

$16.725

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1,900

$18.179

$16.725

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IDEA Electronic Components Group

UK . 869 parts In-Stock

1+ parts

$18.550

100+ parts

$17.622

1k+ parts

$16.695

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869

$18.550

$17.622

$16.695

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ChromeModa Solutions

Germany . 144 parts In-Stock

1+ parts

$18.550

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$15.211

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144

$18.550

$15.211

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Corphita

USA . 4,862 parts In-Stock

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4,862

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Overview

Unlock the power of advanced signal processing with the SNC5480W by Texas Instruments. This DSP peripheral offers unparalleled quality and reliability, backed by the trusted name of its manufacturer. Ideal for military-grade applications, this versatile device delivers exceptional performance in a compact package. Experience the value of cutting-edge technology and unleash the potential of your projects with the SNC5480W.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and durability, ensuring reliable operation in harsh environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures high reliability and quality standards, making this product suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular packages are typically easier to handle and integrate into electronic systems, enhancing overall usability.

No. of Terminals: 14

Having 14 terminals allows for increased connectivity options, enabling versatile and complex circuit designs.

Package Style (Meter): FLATPACK

Flatpack packages are known for their compact size and efficient heat dissipation, making them ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated thermal conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable operation even in cold environments, enhancing overall versatility.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, reducing the risk of connectivity issues.

Temperature Grade: MILITARY

Military-grade temperature ratings ensure ruggedness and resilience, making this product suitable for demanding military applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

As a DSP peripheral with multiplier capabilities, this product offers enhanced signal processing performance and efficiency.

Technology: TTL

TTL technology ensures fast signal processing speeds and low power consumption, making this product ideal for high-speed applications.

Terminal Form: FLAT

Flat terminal forms provide a secure and reliable connection, minimizing the risk of signal loss or interference.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this product allows for high-density mounting and compact PCB layouts, improving overall design flexibility.

Technical Specifications

DSP Peripherals SNC5480W attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F14

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

DSP Peripherals

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNC5480W Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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