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ADSP-3211TG/+

Analog Devices

ADSP-3211TG/+ by Analog Devices

Analog Devices' ADSP-3211TG/+ is a MIL-grade DSP peripheral IC with 144-pin grid array package. Features CMOS technology, -55 to 125°C operating range, and tin/lead terminals. Ideal for military applications requiring high-performance signal processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,564 parts In-Stock

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Digiode

USA . 726 parts In-Stock

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726

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Native Components

USA . 650 parts In-Stock

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$0.052

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$0.050

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$0.052

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$0.050

Semicontronic

India . 1,061 parts In-Stock

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$9.000

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$8.775

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$8.730

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$9.000

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AZTECH Wire

Italy . 416 parts In-Stock

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$10.922

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One Stop Electronics

USA . 1,637 parts In-Stock

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$26.000

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Corohmni

South Africa . 606 parts In-Stock

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$69.022

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Parana Technologies

USA . 887 parts In-Stock

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$79.660

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$74.084

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IDEA Electronic Components Group

UK . 1,558 parts In-Stock

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$85.656

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$81.373

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DigiPath Technology Company

USA . 2,092 parts In-Stock

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$133.623

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$128.278

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Northwest PG Solutions

USA . 1,804 parts In-Stock

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Corphita

USA . 762 parts In-Stock

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Overview

Unlock the power of high-performance signal processing with the ADSP-3211TG/+ by Analog Devices. This cutting-edge DSP peripheral offers unmatched quality and reliability, backed by a trusted manufacturer with a proven track record in the industry. Ideal for military-grade applications, this versatile device delivers unparalleled value and benefits to customers seeking top-of-the-line performance in a compact package. Experience the advantages of advanced technology and precision engineering with the ADSP-3211TG/+.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer high thermal conductivity and excellent resistance to high temperatures, making them ideal for military-grade applications requiring stable performance in harsh environments.

Package Shape: SQUARE

The square shape allows for efficient use of space on a PCB, especially when multiple DSP peripherals need to be integrated within limited board real estate.

No. of Terminals: 144

With 144 terminals, this DSP peripheral offers a high level of connectivity and versatility for interfacing with other components and peripherals in a system.

Package Style (Meter): GRID ARRAY

The grid array package style provides a reliable connection between the DSP peripheral and the PCB, ensuring minimal signal loss and improved overall system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this DSP peripheral to operate reliably in extreme conditions without compromising its performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the DSP peripheral can also function in cold environments, making it suitable for a wide range of applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and resistance to corrosion, ensuring a durable and long-lasting connection between the DSP peripheral and the PCB.

Terminal Position: PERPENDICULAR

Perpendicular terminal positioning simplifies the installation process and improves signal integrity by reducing signal distortion and minimizing interference.

Temperature Grade: MILITARY

Military-grade temperature grade ensures that this DSP peripheral meets stringent reliability and performance standards required in defense and aerospace applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

The DSP peripheral with a multiplier function enhances signal processing capabilities, making it suitable for applications requiring complex mathematical operations and high-speed data processing.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and faster processing speeds, making this DSP peripheral energy-efficient and reliable.

Terminal Form: PIN/PEG

The pin/peg terminal form provides a secure and stable connection between the DSP peripheral and the PCB, reducing the risk of signal loss and ensuring consistent performance.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy assembly and maintenance, enabling efficient PCB layout and facilitating robust connections between the DSP peripheral and other components.

Technical Specifications

DSP Peripherals ADSP-3211TG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P144

JESD-609 Code:

e0

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

ADSP-3211TG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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