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ADSP-1101SG/+

Analog Devices

ADSP-1101SG/+ by Analog Devices

Analog Devices' ADSP-1101SG/+ is a DSP Peripheral with 20-bit output bus, 16-bit external data bus, and 9.52 MHz clock frequency. Ideal for military applications due to its MIL-graded temperature range and CMOS technology, it features a max supply voltage of 5.5V and operates b/w -55°C to 125°C.

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2

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1k+

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Vyrian

USA . 7,647 parts In-Stock

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Digiode

USA . 758 parts In-Stock

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Northwest PG Solutions

USA . 362 parts In-Stock

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$3.047

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One Stop Electronics

USA . 1,591 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 705 parts In-Stock

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Semicontronic

India . 500 parts In-Stock

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$20.000

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$19.500

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Parana Technologies

USA . 135 parts In-Stock

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$28.238

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$26.261

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IDEA Electronic Components Group

UK . 170 parts In-Stock

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$30.363

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$28.845

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Corohmni

South Africa . 623 parts In-Stock

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$36.837

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DigiPath Technology Company

USA . 1,264 parts In-Stock

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$47.366

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$45.472

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Native Components

USA . 131 parts In-Stock

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Corphita

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Overview

Elevate your projects with the top-notch performance of the ADSP-1101SG/+ by Analog Devices. This DSP peripheral boasts superior quality and reliability, thanks to its ceramic, metal-sealed cofired package body material. With a wide range of applications in various industries, this product offers unmatched value and benefits to customers looking for high-speed processing capabilities. Trust Analog Devices to deliver cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides good thermal conductivity and excellent reliability, making this product suitable for high temperature environments.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product can handle higher voltage requirements, providing flexibility in different application scenarios.

Output Data Bus Width: 20

With a wide output data bus width of 20, this product can support high-speed data processing and efficient communication between components.

Power Supplies (V): 5

Operating at a standard 5V power supply, this product is compatible with common power sources and reduces the need for additional voltage regulation.

No. of Terminals: 100

Having 100 terminals allows for versatile connectivity options and integration with various systems and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides a higher terminal density, allowing for compact design and space-saving in the overall system layout.

Maximum Operating Temperature: 125 °C

Operating at a maximum temperature of 125°C, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product is suitable for use in extreme cold environments where reliable operation is essential.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good solderability and reliable electrical connections, enhancing the overall durability and longevity of the product.

Maximum Seated Height: 4.29 mm

With a maximum seated height of 4.29mm, this product offers a low profile design, making it suitable for applications where space is limited.

Maximum Clock Frequency: 9.52 MHz

Operating at a maximum clock frequency of 9.52MHz, this product provides fast processing speeds and real-time performance for time-sensitive applications.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product is rugged and reliable, ensuring optimal performance in harsh environments and mission-critical operations.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing overall reliability and efficiency.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54mm, this product allows for easy PCB layout and assembly, simplifying the integration process and reducing manufacturing complexity.

Technical Specifications

DSP Peripherals ADSP-1101SG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

9.52 MHz

External Data Bus Width:

16

JESD-30 Code:

S-CPGA-P100

JESD-609 Code:

e0

Length:

33.525 mm

Low Power Mode:

NO

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

20

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA100M,13X13

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.29 mm

Sub-Category:

Math Processors

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

33.525 mm

Trade Compliance

ADSP-1101SG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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