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5962-9220505M3A

Texas Instruments

5962-9220505M3A by Texas Instruments

Texas Instruments' 5962-9220505M3A is a DSP peripheral with CMOS technology. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V. Ideal for military applications due to MIL-STD-883 screening level and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,905 parts In-Stock

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4,905

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Vyrian

USA . 3,946 parts In-Stock

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3,946

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Distributors (Availability)

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AZTECH Wire

Italy . 531 parts In-Stock

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$13.404

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531

$13.404

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Parana Technologies

USA . 1,275 parts In-Stock

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$27.332

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$34.664

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1,275

$27.332

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$34.664

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ChromeModa Solutions

Germany . 4,697 parts In-Stock

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$30.710

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$25.182

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4,697

$30.710

$25.182

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IDEA Electronic Components Group

UK . 161 parts In-Stock

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$30.710

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$29.174

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$27.639

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161

$30.710

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$27.639

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One Stop Electronics

USA . 126 parts In-Stock

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$33.000

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126

$33.000

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Corohmni

South Africa . 1,177 parts In-Stock

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$56.609

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Native Components

USA . 195 parts In-Stock

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$89.770

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$86.179

195

$89.770

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$86.179

Northwest PG Solutions

USA . 116 parts In-Stock

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$98.747

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116

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Corphita

USA . 4,850 parts In-Stock

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4,850

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DigiPath Technology Company

USA . 954 parts In-Stock

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$27.688

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954

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Overview

Experience unparalleled quality and performance with the 5962-9220505M3A by Texas Instruments. Designed with cutting-edge technology and precision engineering, this DSP Peripheral offers exceptional reliability and versatility for a wide range of applications. Whether you're in aerospace, defense, or telecommunications, this product delivers unmatched value, benefits, and advantages to meet your needs. Trust Texas Instruments for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and resistance to harsh environmental conditions, making this product suitable for use in rugged applications.

Surface Mount: YES

Being surface mount compatible enhances ease of assembly and allows for compact design layouts, saving space in electronic devices.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V enables compatibility with a wide range of power sources, providing flexibility in system design.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening standards ensures high reliability and quality, meeting strict military and aerospace requirements.

Package Shape: SQUARE

The square package shape facilitates uniform thermal dissipation and efficient PCB layout, contributing to overall system performance and reliability.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and enables integration with various external components, enhancing functionality and versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced shock and vibration resistance, making it ideal for applications where mechanical robustness is essential.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures compatibility with a wide range of power sources while optimizing energy efficiency in operation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments and operate reliably in demanding conditions.

Minimum Operating Temperature: -55 °C

The wide operating temperature range of -55°C to 125°C allows for operation in extreme cold or hot environments, increasing the product's versatility.

Terminal Position: QUAD

The quad terminal position offers robust connectivity and secure attachment to the PCB, ensuring reliable signal transmission and maintaining system integrity.

Temperature Grade: MILITARY

Designed to meet military-grade temperature specifications, this product is suitable for mission-critical applications where high reliability and performance are essential.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

The digital signal processing (DSP) peripheral with pipeline register technology enables fast data processing and efficient signal handling, making this product ideal for real-time applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance and efficiency of the product.

Terminal Form: NO LEAD

The no lead terminal form simplifies the assembly process and reduces the risk of solder joint failures, improving manufacturability and long-term reliability.

Maximum Supply Current: 21.8 mA

The low maximum supply current of 21.8mA helps in minimizing power consumption and heat generation, contributing to energy efficiency and prolonged product lifespan.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides stable and consistent power delivery, ensuring reliable operation and performance consistency in the system.

Technical Specifications

DSP Peripherals 5962-9220505M3A attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

JESD-30 Code:

S-CQCC-N28

Low Power Mode:

NO

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Current:

21.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

5962-9220505M3A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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