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5962-9220505MLA

Texas Instruments

5962-9220505MLA by Texas Instruments

The Texas Instruments 5962-9220505MLA is a MIL-STD-883 compliant DSP Peripheral with CMOS technology. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V and max current draw of 21.8mA. Ideal for military applications requiring high-performance signal processing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,386 parts In-Stock

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Digiode

USA . 264 parts In-Stock

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264

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AZTECH Wire

Italy . 223 parts In-Stock

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$5.967

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223

$5.967

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One Stop Electronics

USA . 1,311 parts In-Stock

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$24.000

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$24.000

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Corohmni

South Africa . 456 parts In-Stock

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$29.583

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456

$29.583

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Parana Technologies

USA . 391 parts In-Stock

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$71.534

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$6,642.994

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$64.380

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391

$71.534

$6,642.994

$64.380

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Native Components

USA . 992 parts In-Stock

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$78.630

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$75.485

992

$78.630

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$75.485

DigiPath Technology Company

USA . 236 parts In-Stock

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$78.768

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236

$78.768

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ChromeModa Solutions

Germany . 2,116 parts In-Stock

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$80.375

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$65.908

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$80.375

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IDEA Electronic Components Group

UK . 463 parts In-Stock

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$80.375

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$76.356

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$72.338

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463

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$72.338

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Northwest PG Solutions

USA . 1,882 parts In-Stock

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$86.493

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$86.493

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Corphita

USA . 1,333 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments 5962-9220505MLA. Designed with precision and reliability in mind, this DSP Peripheral offers unmatched performance in a wide range of military-grade applications. With a durable ceramic, glass-sealed package and a maximum supply voltage of 5.5V, this product is built to withstand even the harshest environments. Experience seamless integration and superior functionality with the Texas Instruments 5962-9220505MLA – your ultimate solution for all your DSP Peripheral needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability, making this product suitable for harsh environmental conditions.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this product can handle high voltage requirements, providing flexibility in various applications.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 screening level ensures high quality and reliability, meeting stringent military standards for performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout and space utilization in electronic circuits, optimizing the overall design of the product.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options and versatility in connecting the product within a system or circuit.

Package Style (Meter): IN-LINE

The in-line package style offers ease of integration and maintenance, simplifying the installation process and enhancing product usability.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures energy efficiency and compatibility with power sources that may have limited output.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the product to function reliably in cold environments or during temperature fluctuations.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves connectivity reliability, ensuring stable performance in challenging operating conditions.

Temperature Grade: MILITARY

The military-grade temperature rating indicates the product's ruggedness and suitability for defense, aerospace, and other mission-critical applications.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

Being a DSP peripheral with pipeline register enhances processing speed and efficiency, making this product ideal for real-time signal processing and data handling tasks.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and fast switching speeds, contributing to energy efficiency and reliable performance.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and secure connections, ensuring robust mechanical stability and longevity of the product.

Maximum Supply Current: 21.8 mA

With a maximum supply current of 21.8 mA, this product consumes low power, minimizing energy costs and heat dissipation, while maintaining optimal performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing power sources.

Technical Specifications

DSP Peripherals 5962-9220505MLA attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

JESD-30 Code:

R-GDIP-T24

Low Power Mode:

NO

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Current:

21.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

5962-9220505MLA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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