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5962-9220503MLA

Texas Instruments

5962-9220503MLA by Texas Instruments

Texas Instruments' 5962-9220503MLA is a MIL-STD-883 compliant DSP Peripheral with CMOS technology. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V. Ideal for military applications due to its robust ceramic package and low power consumption at 21.8mA max current draw.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,464 parts In-Stock

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Digiode

USA . 2,364 parts In-Stock

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2,364

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One Stop Electronics

USA . 1,263 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 240 parts In-Stock

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$11.994

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$11.994

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Corohmni

South Africa . 1 parts In-Stock

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$24.397

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Parana Technologies

USA . 1,257 parts In-Stock

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$43.112

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$43.112

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DigiPath Technology Company

USA . 175 parts In-Stock

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$47.472

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175

$47.472

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ChromeModa Solutions

Germany . 6,960 parts In-Stock

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$48.441

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$39.722

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IDEA Electronic Components Group

UK . 554 parts In-Stock

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$48.441

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$46.019

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$43.597

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Native Components

USA . 197 parts In-Stock

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$66.347

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$63.693

197

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$63.693

Northwest PG Solutions

USA . 582 parts In-Stock

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$72.982

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Corphita

USA . 1,750 parts In-Stock

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Overview

Upgrade your system with the high-quality 5962-9220503MLA by Texas Instruments, a top-of-the-line DSP Peripheral that offers unmatched performance and reliability. Manufactured with precision using ceramic and glass-sealed materials, this military-grade component is designed to operate in extreme temperatures ranging from -55°C to 125°C. With 24 terminals and a maximum supply voltage of 5.5V, this product is perfect for a wide range of applications. Trust Texas Instruments to deliver cutting-edge technology that enhances your systems' capabilities. Choose the 5962-9220503MLA for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent protection and durability, ensuring a reliable and long-lasting product.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

Screening Level: MIL-STD-883

Ensures high quality and reliability as per military standards, suitable for critical applications.

Package Shape: RECTANGULAR

Optimal design for efficient packaging and integration in various systems.

No. of Terminals: 24

Provides ample connectivity options for interfacing with other components or devices.

Package Style (Meter): IN-LINE

Space-saving design for efficient use of PCB real estate.

Minimum Supply Voltage: 4.5 V

Allows for operation in low voltage conditions, increasing versatility.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely cold conditions, ensuring reliability in various environments.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connection options.

Temperature Grade: MILITARY

Meets stringent military standards for performance and reliability, ideal for mission-critical applications.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

Designed for high-performance signal processing tasks with efficient pipeline register architecture.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during installation.

Maximum Supply Current: 21.8 mA

Low supply current consumption for efficient use of power resources.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with various systems and applications.

Technical Specifications

DSP Peripherals 5962-9220503MLA attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

JESD-30 Code:

R-GDIP-T24

Low Power Mode:

NO

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Supply Current:

21.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

5962-9220503MLA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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