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5962-9233101MXA

Onsemi

5962-9233101MXA by Onsemi

Onsemi's 5962-9233101MXA is a MIL-STD-883 compliant DSP Peripheral with CMOS technology. It operates b/w -55 to 125 °C and supports supply voltage range of 4.5V to 5.5V. Ideal for military applications requiring coordinate transform processing in a ceramic, metal-sealed co-fired package style with 120 terminals in grid array format.

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5962-9233101MXA by Onsemi
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Digiode

USA . 1,011 parts In-Stock

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Native Components

USA . 252 parts In-Stock

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Northwest PG Solutions

USA . 833 parts In-Stock

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Kulean Microsystems

USA . 7,372 parts In-Stock

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SupplyDigital Components

Austria . 5,028 parts In-Stock

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Problanco Electronics

Mexico . 3,542 parts In-Stock

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TANS Electronics

Latvia . 2,871 parts In-Stock

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Corphita

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Corohmni

South Africa . 376 parts In-Stock

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the 5962-9233101MXA by Onsemi. Crafted with precision and expertise, this DSP peripheral offers cutting-edge technology for a wide range of applications. From coordinate transform processing to military-grade operations, this product guarantees top-notch quality and seamless functionality. Elevate your projects with the value and benefits that only Onsemi can provide. Trust in the advantages of this innovative solution and unlock limitless possibilities for your endeavors.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures high durability and reliability, making this product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle higher power requirements and voltages, providing flexibility in usage scenarios.

Screening Level: MIL-STD-883

Meeting MIL-STD-883 screening level ensures quality and reliability, making this product ideal for military and aerospace applications where stringent standards need to be met.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into various systems and designs.

No. of Terminals: 120

With a high number of terminals, this product offers versatility in connectivity options and can support a wide range of functions.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with various power sources and helps in conserving energy during operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this product to operate reliably in extreme temperature conditions, expanding its suitability for various environments.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures this product can function in cold environments without any issues, making it versatile in deployment scenarios.

Temperature Grade: MILITARY

Designed to meet military-grade temperature specifications, ensuring optimal performance in demanding conditions encountered in military and defense applications.

Peripheral IC Type: DSP PERIPHERAL, COORDINATE TRANSFORM PROCESSOR

Featuring DSP peripheral and coordinate transform processor, this product offers advanced processing capabilities and integration options, suitable for signal processing applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high speed operation, and compatibility with a wide range of systems, enhancing the overall efficiency of this product.

Terminal Form: PIN/PEG

The use of PIN/PEG terminal form offers secure and reliable connections, ensuring stable performance and ease of integration during installation.

Nominal Supply Voltage: 5 V

With a standard nominal supply voltage of 5V, this product can easily interface with common power sources and systems, simplifying integration and operation.

Technical Specifications

DSP Peripherals 5962-9233101MXA attributes and parameters. Explore more DSP Peripherals devices from Onsemi

Specs

Boundary Scan:

NO

JESD-30 Code:

R-CPGA-P120

Low Power Mode:

NO

No. of Terminals:

120

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Screening Level:

MIL-STD-883

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

PERPENDICULAR

Trade Compliance

5962-9233101MXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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