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5962-9220502MLX

Texas Instruments

5962-9220502MLX by Texas Instruments

Texas Instruments' 5962-9220502MLX is a MIL-STD-883 compliant DSP Peripheral with 8-bit output data bus width, operating at up to 6.25 MHz clock frequency. Ideal for military applications requiring CMOS technology, it features a ceramic package body and operates b/w -55°C to 125°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,562 parts In-Stock

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5,562

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Digiode

USA . 4,306 parts In-Stock

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4,306

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Distributors (Availability)

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AZTECH Wire

Italy . 841 parts In-Stock

1+ parts

$12.186

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841

$12.186

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Parana Technologies

USA . 324 parts In-Stock

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$28.077

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$43.483

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324

$28.077

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$43.483

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One Stop Electronics

USA . 1,057 parts In-Stock

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$29.000

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1,057

$29.000

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DigiPath Technology Company

USA . 1,261 parts In-Stock

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$30.916

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$28.443

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1,261

$30.916

$28.443

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ChromeModa Solutions

Germany . 2,097 parts In-Stock

1+ parts

$31.547

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$25.869

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2,097

$31.547

$25.869

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IDEA Electronic Components Group

UK . 1,893 parts In-Stock

1+ parts

$31.547

100+ parts

$29.970

1k+ parts

$28.392

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1,893

$31.547

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$28.392

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Native Components

USA . 339 parts In-Stock

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$52.450

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$50.352

339

$52.450

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$50.352

Northwest PG Solutions

USA . 1,916 parts In-Stock

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$57.695

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1,916

$57.695

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Corphita

USA . 648 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the 5962-9220502MLX by Texas Instruments. Crafted with precision and expertise, this DSP Peripheral offers cutting-edge technology ideal for military-grade applications. With a maximum operating temperature of 125°C and a minimum supply voltage of 4.5V, this product ensures optimal functionality in any environment. Trust Texas Instruments to deliver top-notch quality and unmatched value with the 5962-9220502MLX. Elevate your projects with this exceptional component today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliable performance in harsh environments.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options while maintaining stable operation.

Screening Level: MIL-STD-883

Ensures high reliability and quality standards are met for military and aerospace applications.

Output Data Bus Width: 8

Offers high-speed data processing capabilities for efficient performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for rugged operating conditions.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold environments without compromising performance.

Maximum Clock Frequency: 6.25 MHz

Supports fast data processing speeds for quick and efficient operations.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

DSP Peripherals 5962-9220502MLX attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

6.25 MHz

External Data Bus Width:

8

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

Low Power Mode:

NO

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

21.8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

5962-9220502MLX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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