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5962-9233102MXA

Onsemi

5962-9233102MXA by Onsemi

Onsemi's 5962-9233102MXA is a MIL-STD-883 compliant DSP Peripheral with CMOS technology. It operates b/w -55 to 125 °C, with supply voltage range of 4.5V to 5.5V. Ideal for military applications requiring coordinate transform processing in a ceramic, metal-sealed co-fired package style.

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5962-9233102MXA by Onsemi
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Vyrian

USA . 1,837 parts In-Stock

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Digiode

USA . 429 parts In-Stock

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Native Components

USA . 736 parts In-Stock

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$1.660

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Northwest PG Solutions

USA . 1,816 parts In-Stock

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TANS Electronics

Latvia . 4,386 parts In-Stock

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SupplyDigital Components

Austria . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 1,439 parts In-Stock

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UHIMA Technologies

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Kulean Microsystems

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Corphita

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Corohmni

South Africa . 404 parts In-Stock

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Overview

Unlock the full potential of your DSP peripherals with the 5962-9233102MXA by Onsemi. Manufactured with precision and reliability in mind, this cutting-edge device offers unrivaled performance for a wide range of applications. From coordinate transform processing to military-grade operations, this product delivers unparalleled value, benefits, and advantages to customers looking for top-of-the-line solutions. Trust Onsemi to provide you with the quality you need for success.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package material ensures durability and reliability in various environmental conditions, making it ideal for military applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatile usage in systems that may require higher power handling capabilities.

Screening Level: MIL-STD-883

The MIL-STD-883 screening level ensures that the product meets stringent military standards for quality and reliability.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space and allows for easier integration into systems.

No. of Terminals: 120

With a large number of terminals, this product offers versatile connectivity options for various signal processing applications.

Package Style (Meter): GRID ARRAY

The grid array package style ensures easy assembly and reliable connections, making it suitable for complex circuit designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for energy-efficient operation while still providing enough power for effective signal processing.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature enables this product to function reliably in harsh environments without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures that the product can operate in extreme cold conditions, expanding its usability in various environments.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy connections and secure mounting, enhancing the overall reliability of the product.

Temperature Grade: MILITARY

Designed for military-grade applications, this product meets high standards for performance and durability in demanding environments.

Peripheral IC Type: DSP PERIPHERAL, COORDINATE TRANSFORM PROCESSOR

The DSP peripheral with coordinate transform processor enhances signal processing capabilities, making it suitable for applications requiring complex data transformations.

Technology: CMOS

Utilizing CMOS technology, this product offers efficient power consumption and high-speed operation, making it suitable for a wide range of digital processing tasks.

Terminal Form: PIN/PEG

The pin/peg terminal form ensures secure connections and easy integration into existing systems, adding to the overall reliability of the product.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this product is compatible with standard power sources, making it easy to integrate into existing systems.

Technical Specifications

DSP Peripherals 5962-9233102MXA attributes and parameters. Explore more DSP Peripherals devices from Onsemi

Specs

Boundary Scan:

NO

JESD-30 Code:

R-CPGA-P120

Low Power Mode:

NO

No. of Terminals:

120

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Screening Level:

MIL-STD-883

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

PERPENDICULAR

Trade Compliance

5962-9233102MXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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