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ADSP-3211UG/+

Analog Devices

ADSP-3211UG/+ by Analog Devices

Analog Devices' ADSP-3211UG/+ is a MIL-grade DSP peripheral IC with 144-pin grid array package. Operating temp range: -55 to 125°C. Features CMOS tech, suitable for military applications requiring high-performance signal processing and multiplication capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,523 parts In-Stock

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Digiode

USA . 754 parts In-Stock

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754

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One Stop Electronics

USA . 1,108 parts In-Stock

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$9.000

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$9.000

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Semicontronic

India . 885 parts In-Stock

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$12.000

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$11.700

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$11.640

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885

$12.000

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Native Components

USA . 51 parts In-Stock

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$13.301

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51

$13.301

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AZTECH Wire

Italy . 403 parts In-Stock

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$13.380

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403

$13.380

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Northwest PG Solutions

USA . 2,343 parts In-Stock

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$14.631

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$13.168

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Parana Technologies

USA . 3,874 parts In-Stock

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$48.201

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$44.827

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3,874

$48.201

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$44.827

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Corohmni

South Africa . 1,042 parts In-Stock

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$51.412

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

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$51.829

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$49.238

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DigiPath Technology Company

USA . 3,874 parts In-Stock

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$80.853

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$77.619

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$77.619

3,874

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Corphita

USA . 124 parts In-Stock

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Overview

Enhance your digital signal processing capabilities with the ADSP-3211UG/+ by Analog Devices. Designed with precision and reliability in mind, this DSP peripheral offers unparalleled performance for a wide range of applications. Whether you're working on telecommunications, audio processing, or automotive systems, this product delivers exceptional results. With Analog Devices' reputation for excellence in the industry, you can trust that you're getting top-of-the-line quality and innovation. Upgrade your projects with the ADSP-3211UG/+ and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its durability and high thermal conductivity, making it suitable for high temperature environments and providing good thermal management for the product.

No. of Terminals: 144

Having a high number of terminals allows for a greater connectivity and flexibility in connecting the peripheral to other devices or components.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can endure high levels of heat without compromising its performance, ensuring reliability in various operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Pitch: 2.54 mm

A standard terminal pitch of 2.54 mm allows for easy and secure connections with other components, enhancing the overall ease of integration of the product.

Technical Specifications

DSP Peripherals ADSP-3211UG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P144

JESD-609 Code:

e0

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA144,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

ADSP-3211UG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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