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SMJ34082-32GCM

Texas Instruments

SMJ34082-32GCM by Texas Instruments

SMJ34082-32GCM by Texas Instruments is a military-grade DSP peripheral with max clock freq of 32MHz. Its package style is grid array, with 145 terminals and temp range from -55 to 125°C. Ideal for applications requiring high-speed signal processing in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,366 parts In-Stock

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9,366

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Digiode

USA . 1,630 parts In-Stock

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1,630

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Distributors (Availability)

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AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$11.063

100+ parts

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541

$11.063

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Parana Technologies

USA . 394 parts In-Stock

1+ parts

$22.639

100+ parts

-

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$23.299

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394

$22.639

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$23.299

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DigiPath Technology Company

USA . 1,443 parts In-Stock

1+ parts

$24.928

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1,443

$24.928

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ChromeModa Solutions

Germany . 2,756 parts In-Stock

1+ parts

$25.437

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$20.858

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2,756

$25.437

$20.858

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IDEA Electronic Components Group

UK . 1,463 parts In-Stock

1+ parts

$25.437

100+ parts

$24.165

1k+ parts

$22.893

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1,463

$25.437

$24.165

$22.893

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One Stop Electronics

USA . 581 parts In-Stock

1+ parts

$33.000

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581

$33.000

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Corohmni

South Africa . 2,210 parts In-Stock

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$86.605

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2,210

$86.605

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Corphita

USA . 4,219 parts In-Stock

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4,219

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Overview

Elevate your electronic projects with the SMJ34082-32GCM by Texas Instruments, a high-quality DSP peripheral that promises top-notch performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product is designed to exceed your expectations. Whether you are working on signal processing, digital communications, or audio applications, this versatile component offers unparalleled value, benefits, and advantages. Upgrade your designs today with the SMJ34082-32GCM and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability, making this product suitable for harsh environments.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into various systems or circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures stable performance even in demanding conditions.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency of 32 MHz allows for fast and efficient processing of data, making it suitable for applications requiring high-speed processing.

Temperature Grade: MILITARY

The military-grade temperature ensures that the product can withstand extreme temperature variations and harsh operating conditions.

Technical Specifications

DSP Peripherals SMJ34082-32GCM attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Maximum Clock Frequency:

32 MHz

JESD-30 Code:

S-CPGA-P145

Length:

38.85 mm

No. of Terminals:

145

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

38.85 mm

Trade Compliance

SMJ34082-32GCM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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