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ADSP-1016ASG/+

Analog Devices

ADSP-1016ASG/+ by Analog Devices

Analog Devices' ADSP-1016ASG/+ is a MIL-grade DSP peripheral with 68-pin grid array package. Operating b/w -55°C to 125°C, it has a supply voltage of 5V and CMOS technology. Ideal for military applications requiring high-performance signal processing capabilities.

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Vyrian

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Northwest PG Solutions

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$2.445

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AZTECH Wire

Italy . 307 parts In-Stock

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Semicontronic

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One Stop Electronics

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Corohmni

South Africa . 204 parts In-Stock

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Parana Technologies

USA . 1,583 parts In-Stock

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IDEA Electronic Components Group

UK . 1,788 parts In-Stock

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DigiPath Technology Company

USA . 1,978 parts In-Stock

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Native Components

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Overview

Unlock the power of advanced signal processing with the Analog Devices ADSP-1016ASG/+. Manufactured by a trusted industry leader, this DSP peripheral offers unparalleled quality and reliability. Ideal for military-grade applications, this versatile device boasts a square ceramic package body and 68 terminals in a grid array style. With a wide operating temperature range and a nominal supply voltage of 5V, the ADSP-1016ASG/+ delivers exceptional performance in demanding environments. Experience the value and benefits of cutting-edge technology with this innovative product from Analog Devices.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal conductivity and are suitable for high temperature applications, increasing the reliability of the product.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, making it ideal for compact designs.

Power Supplies (V): 5

Operating at 5 volts gives this product compatibility with a wide range of systems and makes it easy to integrate into existing circuitry.

No. of Terminals: 68

Having a high number of terminals allows for versatile connectivity options and greater flexibility in designing complex systems.

Package Style (Meter): GRID ARRAY

The grid array package style provides high density mounting, enabling efficient use of space on the circuit board and facilitating better signal integrity.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product is suitable for harsh environments and applications with high temperature requirements.

Minimum Operating Temperature: -55 °C

The ability to operate at as low as -55°C ensures reliable performance even in cold environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and ensures a secure connection, enhancing the product's reliability.

Terminal Position: PERPENDICULAR

Perpendicular terminal position simplifies the assembly process and allows for easy insertion into the circuit board, saving time and effort during production.

Temperature Grade: MILITARY

Military-grade temperature specifications indicate that this product meets stringent reliability and performance standards, making it suitable for mission-critical applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a DSP peripheral with multiplier capabilities, this product is well-suited for signal processing applications requiring efficient mathematical operations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems, making this product energy-efficient and versatile.

Terminal Form: PIN/PEG

The PIN/PEG terminal form provides a secure and reliable connection, reducing the risk of disconnections or signal loss.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts ensures compatibility with standard power sources and simplifies system integration.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54 mm enables easy routing of traces on the circuit board and facilitates efficient signal transmission.

Technical Specifications

DSP Peripherals ADSP-1016ASG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P68

JESD-609 Code:

e0

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Sub-Category:

DSP Peripherals

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

ADSP-1016ASG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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