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SNC5480J

Texas Instruments

SNC5480J by Texas Instruments

SNC5480J by Texas Instruments is a MIL-STD-883 Class B (Modified) DSP Peripheral with 14 terminals, operating b/w -55°C to 125°C. It features TTL technology, dual terminal position, and is ideal for military applications requiring high-performance multipliers in a ceramic package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,994 parts In-Stock

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Digiode

USA . 4,747 parts In-Stock

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4,747

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One Stop Electronics

USA . 933 parts In-Stock

1+ parts

$1.000

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933

$1.000

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AZTECH Wire

Italy . 822 parts In-Stock

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$12.444

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822

$12.444

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Corohmni

South Africa . 2,018 parts In-Stock

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$25.765

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2,018

$25.765

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Parana Technologies

USA . 1,214 parts In-Stock

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$36.220

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1,214

$36.220

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DigiPath Technology Company

USA . 209 parts In-Stock

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$39.883

100+ parts

$36.692

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209

$39.883

$36.692

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ChromeModa Solutions

Germany . 2,393 parts In-Stock

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$40.697

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$33.372

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2,393

$40.697

$33.372

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IDEA Electronic Components Group

UK . 279 parts In-Stock

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$40.697

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$38.662

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$36.627

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279

$40.697

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$36.627

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Corphita

USA . 1,418 parts In-Stock

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Overview

Enhance your next project with the SNC5480J by Texas Instruments, a top-quality DSP Peripheral that brings unmatched precision and reliability to your designs. Manufactured by industry leader Texas Instruments, this product offers exceptional value and performance for a wide range of applications. With its MIL-STD-883 Class B screening level and military-grade temperature grade, the SNC5480J is designed to excel in even the most demanding environments. Trust Texas Instruments to deliver cutting-edge technology and superior quality with the SNC5480J.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity and superior protection for the internal components, ensuring reliability in a variety of operating conditions.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures that the product meets stringent quality and reliability standards, making it suitable for a wide range of high-reliability applications.

No. of Terminals: 14

The ample number of terminals allows for versatile connection options and integration into various system designs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments without compromising performance.

Technology: TTL

The use of TTL technology ensures compatibility with a wide range of digital systems and provides reliable signal processing capabilities.

Terminal Form: THROUGH-HOLE

Through-hole terminals are ideal for robust mechanical connections and ease of assembly, enhancing the overall durability and reliability of the product.

Technical Specifications

DSP Peripherals SNC5480J attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNC5480J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-091-0549, 5962010910549

NIIN

010910549

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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