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SNC54LS261W

Texas Instruments

SNC54LS261W by Texas Instruments

SNC54LS261W by Texas Instruments is a DSP peripheral IC with MIL-STD-883 Class B screening. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. This TTL technology device comes in a ceramic flatpack package with 16 terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,320 parts In-Stock

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7,320

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Digiode

USA . 3,703 parts In-Stock

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3,703

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Distributors (Availability)

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AZTECH Wire

Italy . 359 parts In-Stock

1+ parts

$5.556

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359

$5.556

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One Stop Electronics

USA . 790 parts In-Stock

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$22.000

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790

$22.000

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Corohmni

South Africa . 695 parts In-Stock

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$25.995

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695

$25.995

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Parana Technologies

USA . 1,771 parts In-Stock

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$64.545

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1,771

$64.545

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ChromeModa Solutions

Germany . 4,807 parts In-Stock

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$72.523

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$59.469

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4,807

$72.523

$59.469

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IDEA Electronic Components Group

UK . 1,844 parts In-Stock

1+ parts

$72.523

100+ parts

$68.897

1k+ parts

$65.271

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1,844

$72.523

$68.897

$65.271

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Corphita

USA . 4,416 parts In-Stock

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DigiPath Technology Company

USA . 706 parts In-Stock

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$65.387

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706

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$65.387

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SNC54LS261W, a top-tier DSP Peripheral known for its unparalleled quality and reliability. Designed by a trusted industry leader, this product is perfect for a wide range of applications in various industries. Experience seamless performance and enhanced efficiency with this high-grade component, offering customers exceptional value and countless benefits. Upgrade your systems today with the SNC54LS261W and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and durability, ensuring reliable performance in harsh environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures high reliability and quality standards, making this product suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of PCB space and easy integration into existing designs.

No. of Terminals: 16

With 16 terminals, this product provides ample connectivity options for interfacing with other components and systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance over a wide range of environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Temperature Grade: MILITARY

Military-grade temperature range and reliability standards ensure optimal performance in demanding military applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

DSP peripheral with multiplier functionality provides advanced signal processing capabilities, making it ideal for applications requiring complex calculations.

Technology: TTL

TTL technology offers fast response times and low power consumption, making this product suitable for high-speed data processing applications.

Terminal Form: FLAT

Flat terminal form allows for easy soldering and secure connections, ensuring reliable operation.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch provides ample spacing for connections, reducing the risk of short circuits and improving overall product reliability.

Technical Specifications

DSP Peripherals SNC54LS261W attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

DSP Peripherals

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNC54LS261W Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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