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SNC54LS384W

Texas Instruments

SNC54LS384W by Texas Instruments

SNC54LS384W by Texas Instruments is a DSP peripheral IC with MIL-STD-883 Class B screening. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military applications. This TTL technology chip comes in a ceramic flatpack package with 16 terminals and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,289 parts In-Stock

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Digiode

USA . 3,261 parts In-Stock

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3,261

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Distributors (Availability)

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AZTECH Wire

Italy . 538 parts In-Stock

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$6.104

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538

$6.104

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Corohmni

South Africa . 19 parts In-Stock

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$22.862

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19

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One Stop Electronics

USA . 431 parts In-Stock

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$35.000

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431

$35.000

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Parana Technologies

USA . 1,144 parts In-Stock

1+ parts

$35.847

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$3,328.977

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$32.263

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1,144

$35.847

$3,328.977

$32.263

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DigiPath Technology Company

USA . 951 parts In-Stock

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$39.472

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951

$39.472

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ChromeModa Solutions

Germany . 5,422 parts In-Stock

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$40.278

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$33.028

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5,422

$40.278

$33.028

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IDEA Electronic Components Group

UK . 1,315 parts In-Stock

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$40.278

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$38.264

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$36.250

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Corphita

USA . 4,401 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SNC54LS384W by Texas Instruments. Designed with precision and quality in mind, this DSP Peripheral offers unparalleled performance for a wide range of applications. With a MIL-STD-883 Class B screening level and military-grade temperature grade, this product ensures reliability and durability in even the most demanding environments. Experience seamless integration and enhanced functionality with this innovative solution. Elevate your projects to new heights with the SNC54LS384W.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent heat resistance and durability, ensuring reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards, saving space and simplifying manufacturing processes.

Screening Level: MIL-STD-883 Class B (Modified)

High screening level ensures product quality, reliability, and compliance with stringent military standards.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and facilitates easier placement and orientation during assembly.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality in a DSP peripheral device.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact design, suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in demanding environments without compromising functionality.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures operability in extreme cold conditions, making it versatile for various settings.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Specifically designed as a DSP peripheral multiplier, offering specialized functionality for processing digital signals efficiently.

Technology: TTL

TTL technology provides fast and reliable signal processing capabilities, suitable for digital applications requiring high speed and accuracy.

Terminal Form: FLAT

Flat terminal form simplifies soldering and connection processes, ensuring secure and stable electrical connections.

Terminal Pitch: 1.27 mm

Optimal terminal pitch allows for precise alignment and spacing on circuit boards, enhancing overall performance and reliability.

Technical Specifications

DSP Peripherals SNC54LS384W attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

DSP Peripherals

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNC54LS384W Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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