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SN74S274J

Texas Instruments

SN74S274J by Texas Instruments

SN74S274J by Texas Instruments is a DSP peripheral IC with TTL technology. It features 20 terminals in an in-line rectangular ceramic package, operating b/w 0°C to 70°C. Ideal for applications requiring a commercial-grade dual-terminal multiplier in a through-hole design with 2.54mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,788 parts In-Stock

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7,788

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Digiode

USA . 2,137 parts In-Stock

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2,137

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Prism Electronics

USA . 19 parts In-Stock

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19

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Distributors (Availability)

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AZTECH Wire

Italy . 637 parts In-Stock

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$8.794

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637

$8.794

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One Stop Electronics

USA . 1,338 parts In-Stock

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$9.000

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1,338

$9.000

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Corohmni

South Africa . 926 parts In-Stock

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$14.948

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926

$14.948

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Parana Technologies

USA . 932 parts In-Stock

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$39.785

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932

$39.785

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DigiPath Technology Company

USA . 2,372 parts In-Stock

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$43.808

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2,372

$43.808

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IDEA Electronic Components Group

UK . 2,243 parts In-Stock

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$44.702

100+ parts

$42.467

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$40.232

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2,243

$44.702

$42.467

$40.232

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ChromeModa Solutions

Germany . 1,388 parts In-Stock

1+ parts

$44.702

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$36.656

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1,388

$44.702

$36.656

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Corphita

USA . 3,106 parts In-Stock

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3,106

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Kepictronics

USA . 151 parts In-Stock

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151

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Overview

Elevate your projects with the SN74S274J by Texas Instruments, a top-quality DSP Peripheral that delivers exceptional performance and reliability. Crafted with precision in a rectangular ceramic package, this multiplier is designed to excel in commercial-grade applications with its advanced technology and dual-terminal configuration. Whether you're working on signal processing or data analysis, this innovative solution offers unmatched value and benefits to enhance your work and streamline your operations. Trust Texas Instruments for cutting-edge solutions that set you apart from the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package body material provides high durability and reliability, making the product suitable for harsh environments and ensuring long-term performance.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuits and PCB layouts, optimizing space efficiency and enabling streamlined design.

No. of Terminals: 20

With 20 terminals, the product offers ample connectivity options, making it versatile and compatible with a wide range of systems and applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable and reliable performance under varying environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the product to function effectively in cooler environments without any performance issues.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a DSP peripheral with multiplier functionality, the product offers advanced digital signal processing capabilities, enhancing overall system performance and efficiency.

Technology: TTL

The use of TTL technology ensures reliable and fast signal processing, making the product suitable for high-speed data processing applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation and soldering process, providing secure connections and improving overall product reliability.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch offers compatibility with standard connectors and PCB layouts, allowing for easy integration and minimizing the risk of connectivity issues.

Technical Specifications

DSP Peripherals SN74S274J attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74S274J Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-104-4770, 5962011044770

NIIN

011044770

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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