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CY29FCT520BTSOCTG4

Texas Instruments

CY29FCT520BTSOCTG4 by Texas Instruments

CY29FCT520BTSOCTG4 by Texas Instruments is a DSP Peripheral with 8-bit output data bus width, operating at 13.33 MHz clock frequency. Ideal for industrial applications, it features low power mode and operates within -40 to 85 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,743 parts In-Stock

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Digiode

USA . 2,525 parts In-Stock

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Native Components

USA . 510 parts In-Stock

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$1.779

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510

$1.779

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Northwest PG Solutions

USA . 385 parts In-Stock

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$1.957

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$1.957

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AZTECH Wire

Italy . 310 parts In-Stock

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$16.457

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$16.457

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One Stop Electronics

USA . 556 parts In-Stock

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$26.000

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Corohmni

South Africa . 2,709 parts In-Stock

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$45.030

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Parana Technologies

USA . 918 parts In-Stock

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$56.571

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DigiPath Technology Company

USA . 962 parts In-Stock

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$62.292

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IDEA Electronic Components Group

UK . 2,276 parts In-Stock

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$63.563

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$60.385

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$57.207

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ChromeModa Solutions

Germany . 1,546 parts In-Stock

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$63.563

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$52.122

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Corphita

USA . 1,316 parts In-Stock

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Microchip USA

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Overview

Elevate your projects to new heights with the CY29FCT520BTSOCTG4 by Texas Instruments. As a leader in DSP Peripherals, Texas Instruments delivers top-notch quality and reliability. This product offers a wide range of applications, providing customers with endless possibilities. With its small outline design and low power mode, this peripheral IC is not only efficient but also cost-effective. Trust Texas Instruments to bring innovation and value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various environmental conditions.

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 5.25 V

Allows for a higher operating voltage, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Efficient use of space and easy to integrate into circuit designs.

Output Data Bus Width: 8

Provides a wide data bus for high-speed data processing and transfer.

Power Supplies (V): 5

Standard voltage requirement for compatibility with common power sources.

No. of Terminals: 24

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): SMALL OUTLINE

Compact size for space-constrained applications.

Minimum Supply Voltage: 4.75 V

Ensures stable operation even at lower voltage levels.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures without issues.

Terminal Position: DUAL

Provides redundancy and flexibility in connection options.

Maximum Seated Height: 2.65 mm

Low profile design for applications with height constraints.

Width: 7.5 mm

Compact width for efficient use of PCB space.

External Data Bus Width: 8

Matches the internal data bus width for seamless data flow.

Maximum Clock Frequency: 13.33 MHz

Provides high processing speed for real-time applications.

Length: 15.4 mm

Optimal length for fitting into standard PCB layouts.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

Specialized IC type for efficient digital signal processing.

Technology: CMOS

Low power consumption and compatibility with modern digital systems.

Terminal Form: GULL WING

Secure terminal form for reliable connections on the PCB.

Nominal Supply Voltage: 5 V

Standard voltage level for easy integration with existing systems.

Terminal Pitch: 1.27 mm

Standard pitch for compatibility with common PCB layouts.

Low Power Mode: YES

Energy-efficient operation for reduced power consumption.

Technical Specifications

DSP Peripherals CY29FCT520BTSOCTG4 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

13.33 MHz

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Low Power Mode:

YES

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Data Bus Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

CY29FCT520BTSOCTG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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