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DF1760U/1KE6

Texas Instruments

DF1760U/1KE6 by Texas Instruments

DF1760U/1KE6 by Texas Instruments is a DSP Peripheral with 4-bit output data bus width and 5V power supplies. Ideal for digital filtering applications, it operates b/w 0-70°C with low power mode support. Package style is small outline, featuring 28 terminals in a rectangular shape.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,689 parts In-Stock

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5,689

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Digiode

USA . 257 parts In-Stock

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257

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Distributors (Availability)

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Native Components

USA . 35 parts In-Stock

1+ parts

$8.070

100+ parts

-

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35

$8.070

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Northwest PG Solutions

USA . 628 parts In-Stock

1+ parts

$8.877

100+ parts

$7.989

1k+ parts

-

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628

$8.877

$7.989

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AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$13.717

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274

$13.717

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One Stop Electronics

USA . 824 parts In-Stock

1+ parts

$19.000

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824

$19.000

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Corohmni

South Africa . 2,740 parts In-Stock

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$20.501

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2,740

$20.501

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Parana Technologies

USA . 1,592 parts In-Stock

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$75.225

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1,592

$75.225

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DigiPath Technology Company

USA . 818 parts In-Stock

1+ parts

$82.833

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818

$82.833

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ChromeModa Solutions

Germany . 3,999 parts In-Stock

1+ parts

$84.523

100+ parts

$69.309

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3,999

$84.523

$69.309

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IDEA Electronic Components Group

UK . 1,229 parts In-Stock

1+ parts

$84.523

100+ parts

$80.297

1k+ parts

$76.071

10k+ parts

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1,229

$84.523

$80.297

$76.071

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Corphita

USA . 240 parts In-Stock

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Overview

Unlock the power of digital signal processing with the Texas Instruments DF1760U/1KE6. As a leader in the industry, Texas Instruments delivers top-quality DSP peripherals that provide unmatched performance and reliability. Whether you're developing audio equipment, telecommunications devices, or industrial control systems, this product offers exceptional value and benefits. With its low power mode and commercial-grade temperature grade, you can trust the DF1760U/1KE6 to meet your needs and exceed your expectations. Experience the advantages of cutting-edge technology in a compact package with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power sources, accommodating a wider range of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into various design layouts, optimizing space and usability.

Output Data Bus Width: 4

A wider output data bus width allows for faster data transfer and processing capabilities, enhancing overall performance.

Power Supplies (V): 5

The product operates efficiently with a standard power supply voltage of 5V, making it compatible with a wide range of power sources.

No. of Terminals: 28

Having a higher number of terminals provides more connectivity options and flexibility in connecting to other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and allows for efficient use of available real estate in the design.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage ensures stable operation even under low voltage conditions, offering reliability in different power scenarios.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures the product can operate in a wide range of environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable performance even in colder environments, making it suitable for a variety of applications.

Terminal Position: DUAL

Dual terminal positions offer redundancy and increased reliability in connectivity, reducing the risk of connection failure.

Maximum Seated Height: 3 mm

The low maximum seated height allows for a compact design, making it easier to integrate into tight spaces and slim devices.

Width: 8.4 mm

The small width of the product saves space on the circuit board, enabling a more efficient and compact overall design.

External Data Bus Width: 4

A wider external data bus width enhances data transfer speeds and processing capabilities, improving overall performance.

Length: 18.3 mm

The moderate length of the product allows for flexibility in the placement and design of the circuit board, accommodating various layout requirements.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes the product suitable for standard operating temperatures, ensuring stable performance in typical environmental conditions.

Peripheral IC Type: DSP PERIPHERAL, DIGITAL FILTER

The specific peripheral IC type and digital filtering capabilities make this product well-suited for digital signal processing applications requiring advanced filtering functionality.

Technology: CMOS

The CMOS technology utilized in the product offers low power consumption and high noise immunity, making it energy-efficient and reliable for digital processing tasks.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during assembly, enhancing the overall reliability of the product.

Maximum Supply Current: 55 mA

The maximum supply current of 55 mA ensures efficient power usage and prevents overloading, contributing to safe and reliable operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a standard requirement in many electronic systems, making this product easy to integrate into existing designs.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density packaging on the circuit board, maximizing connectivity and integration options in compact designs.

Low Power Mode: YES

The low power mode feature enables energy-saving operation, reducing power consumption and extending battery life in portable devices.

Technical Specifications

DSP Peripherals DF1760U/1KE6 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

4

JESD-30 Code:

R-PDSO-G28

Length:

18.3 mm

Low Power Mode:

YES

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

4

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Sub-Category:

DSP Peripherals

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.4 mm

Peripheral IC Type:

Trade Compliance

DF1760U/1KE6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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