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DF1704EG4

Texas Instruments

DF1704EG4 by Texas Instruments

DF1704EG4 by Texas Instruments is a DSP Peripheral IC with 28 terminals, operating at 5V. It features a clock frequency of 24.576 MHz and supports digital filtering applications. The package style is small outline, shrink pitch, making it suitable for various electronic devices requiring high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,839 parts In-Stock

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7,839

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Digiode

USA . 3,222 parts In-Stock

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3,222

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Distributors (Availability)

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$8.258

100+ parts

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786

$8.258

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Native Components

USA . 2 parts In-Stock

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$20.296

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2

$20.296

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Northwest PG Solutions

USA . 1,567 parts In-Stock

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$22.326

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$20.093

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1,567

$22.326

$20.093

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One Stop Electronics

USA . 1,191 parts In-Stock

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$35.000

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1,191

$35.000

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Parana Technologies

USA . 2,263 parts In-Stock

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$42.428

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2,263

$42.428

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DigiPath Technology Company

USA . 1,722 parts In-Stock

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$46.719

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1,722

$46.719

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ChromeModa Solutions

Germany . 1,759 parts In-Stock

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$47.672

100+ parts

$39.091

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1,759

$47.672

$39.091

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IDEA Electronic Components Group

UK . 887 parts In-Stock

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$47.672

100+ parts

$45.288

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$42.905

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887

$47.672

$45.288

$42.905

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Corohmni

South Africa . 1,170 parts In-Stock

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$78.342

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1,170

$78.342

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Corphita

USA . 1,125 parts In-Stock

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Microchip USA

USA . 1,020 parts In-Stock

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Overview

Elevate your audio processing capabilities with the Texas Instruments' DF1704EG4, a top-of-the-line DSP Peripheral that delivers unparalleled quality and performance. Designed with precision and expertise, this compact device is perfect for a wide range of applications, from digital audio processing to advanced filtering. With its innovative technology and reliable manufacturing, the DF1704EG4 guarantees superior results and seamless integration into your projects. Experience the value and benefits of this exceptional product today and take your audio processing to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for easy handling and protection of internal components.

Surface Mount: YES

Convenient installation process and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs for versatile applications.

Package Shape: RECTANGULAR

Efficient use of space on the PCB for compact designs.

Power Supplies (V): 5

Stable power source for consistent performance.

No. of Terminals: 28

Plenty of connection points for interfacing with other components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures for reliable operation in various environments.

Minimum Operating Temperature: -25 °C

Can operate in cold temperatures without performance issues.

Maximum Clock Frequency: 24.576 MHz

High clock frequency allows for fast processing of data.

Technology: CMOS

Modern technology for efficient power consumption and performance.

Maximum Supply Current: 30 mA

Low power consumption for energy-efficient operation.

Technical Specifications

DSP Peripherals DF1704EG4 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

24.576 MHz

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

DSP Peripherals

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Peripheral IC Type:

Trade Compliance

DF1704EG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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