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SN74ALS29818NT3

Texas Instruments

SN74ALS29818NT3 by Texas Instruments

SN74ALS29818NT3 by Texas Instruments is a DSP peripheral IC with 24 terminals in an in-line package. Operating temperature range of 0-70°C, TTL technology, and dual terminal position make it ideal for digital signal processing applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,116 parts In-Stock

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4,116

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Digiode

USA . 2,141 parts In-Stock

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2,141

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Distributors (Availability)

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One Stop Electronics

USA . 1,276 parts In-Stock

1+ parts

$13.000

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1,276

$13.000

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AZTECH Wire

Italy . 855 parts In-Stock

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$15.717

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855

$15.717

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Parana Technologies

USA . 990 parts In-Stock

1+ parts

$37.735

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990

$37.735

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DigiPath Technology Company

USA . 1,934 parts In-Stock

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$41.551

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1,934

$41.551

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ChromeModa Solutions

Germany . 3,717 parts In-Stock

1+ parts

$42.399

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$34.767

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3,717

$42.399

$34.767

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IDEA Electronic Components Group

UK . 812 parts In-Stock

1+ parts

$42.399

100+ parts

$40.279

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$38.159

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812

$42.399

$40.279

$38.159

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Corohmni

South Africa . 5,216 parts In-Stock

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$47.059

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5,216

$47.059

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Corphita

USA . 4,346 parts In-Stock

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4,346

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Overview

Discover the superior quality and reliability of the SN74ALS29818NT3 by Texas Instruments, a leading manufacturer in the industry. This DSP Peripheral offers unparalleled performance and versatility for a wide range of applications, making it an essential component for your projects. With advanced technology and a durable design, this product ensures seamless operation and maximum efficiency. Trust Texas Instruments to deliver innovative solutions that exceed expectations, providing you with the value and benefits you need to succeed. Choose the SN74ALS29818NT3 for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into circuits and compact design layouts.

No. of Terminals: 24

With 24 terminals, this product offers ample connectivity options for interfacing with other devices.

Package Style (Meter): IN-LINE

In-line package style simplifies installation and connection within a circuit or system.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of environments.

Terminal Position: DUAL

Dual terminal position offers increased flexibility for wiring and connections.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes this product suitable for typical commercial applications.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

DSP peripheral with pipeline register technology provides efficient data processing and high-speed performance.

Technology: TTL

TTL technology ensures compatibility with a wide range of digital systems and devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and reliable connections, making installation easier.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54mm allows for easy soldering and connection with standard spacing.

Technical Specifications

DSP Peripherals SN74ALS29818NT3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74ALS29818NT3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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