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SN74LS261D3

Texas Instruments

SN74LS261D3 by Texas Instruments

SN74LS261D3 by Texas Instruments is a DSP peripheral IC with 16 terminals in a small outline package. It operates b/w 0°C to 70°C, utilizing TTL technology for commercial-grade applications. This multiplier chip is surface-mountable and features gull wing terminals, making it ideal for various digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,259 parts In-Stock

1+ parts

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8,259

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Digiode

USA . 1,323 parts In-Stock

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1,323

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 486 parts In-Stock

1+ parts

$7.000

100+ parts

-

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486

$7.000

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AZTECH Wire

Italy . 417 parts In-Stock

1+ parts

$10.151

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417

$10.151

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Corohmni

South Africa . 154 parts In-Stock

1+ parts

$39.813

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154

$39.813

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Parana Technologies

USA . 2,336 parts In-Stock

1+ parts

$42.636

100+ parts

$3,959.431

1k+ parts

$38.373

10k+ parts

-

2,336

$42.636

$3,959.431

$38.373

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DigiPath Technology Company

USA . 1,534 parts In-Stock

1+ parts

$46.948

100+ parts

$43.192

1k+ parts

-

10k+ parts

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1,534

$46.948

$43.192

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ChromeModa Solutions

Germany . 3,509 parts In-Stock

1+ parts

$47.906

100+ parts

$39.283

1k+ parts

-

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3,509

$47.906

$39.283

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IDEA Electronic Components Group

UK . 2,245 parts In-Stock

1+ parts

$47.906

100+ parts

$45.511

1k+ parts

$43.115

10k+ parts

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2,245

$47.906

$45.511

$43.115

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Corphita

USA . 352 parts In-Stock

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352

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Overview

Unlock the power of digital signal processing with the Texas Instruments SN74LS261D3. Designed with precision and expertise, this DSP peripheral offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, this innovative product is perfect for any project that requires high-speed multiplication capabilities. Trust in Texas Instruments to deliver top-quality solutions that exceed expectations. Experience the value and benefits of the SN74LS261D3 today and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and heat resistance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount design simplifies the installation process and reduces the overall size of the product, making it suitable for compact designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, optimizing the layout and enhancing the overall performance.

No. of Terminals: 16

With 16 terminals, the product enables connectivity with multiple external components, enhancing its versatility and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the board, making it ideal for applications where size constraints are a concern.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in challenging environmental conditions, increasing the product's reliability.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows the product to function in a wide range of temperature settings, making it versatile for various applications.

Terminal Position: DUAL

Dual terminal position provides added stability and connectivity options, ensuring secure connections with external devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial environments, making it suitable for a wide range of applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

DSP peripheral with multiplier functionality enhances the processing capabilities of the product, making it suitable for tasks requiring advanced computation.

Technology: TTL

TTL technology offers fast and reliable signal processing, ensuring efficient communication within the product and with external devices.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections with the circuit board, minimizing the risk of disconnection or signal loss.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, the product allows for compact placement of terminals on the board, optimizing the layout and improving connectivity.

Technical Specifications

DSP Peripherals SN74LS261D3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

DSP Peripherals

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74LS261D3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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