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SN750520JD

Texas Instruments

SN750520JD by Texas Instruments

SN750520JD by Texas Instruments is a DSP peripheral IC with a ceramic in-line package. It operates b/w 0°C to 70°C, making it suitable for commercial applications. Featuring pipeline register and through-hole terminals, it is ideal for digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,909 parts In-Stock

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4,909

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Digiode

USA . 3,087 parts In-Stock

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3,087

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Electronic Expediters

USA . 168 parts In-Stock

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168

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 466 parts In-Stock

1+ parts

$7.000

100+ parts

-

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466

$7.000

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AZTECH Wire

Italy . 591 parts In-Stock

1+ parts

$15.794

100+ parts

-

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591

$15.794

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Parana Technologies

USA . 380 parts In-Stock

1+ parts

$16.537

100+ parts

-

1k+ parts

$16.817

10k+ parts

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380

$16.537

-

$16.817

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DigiPath Technology Company

USA . 274 parts In-Stock

1+ parts

$18.209

100+ parts

$16.753

1k+ parts

-

10k+ parts

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274

$18.209

$16.753

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ChromeModa Solutions

Germany . 2,764 parts In-Stock

1+ parts

$18.581

100+ parts

$15.236

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2,764

$18.581

$15.236

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IDEA Electronic Components Group

UK . 845 parts In-Stock

1+ parts

$18.581

100+ parts

$17.652

1k+ parts

$16.723

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845

$18.581

$17.652

$16.723

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Corohmni

South Africa . 120 parts In-Stock

1+ parts

$29.296

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120

$29.296

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Corphita

USA . 2,049 parts In-Stock

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2,049

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Overview

Elevate your audio experience with the SN750520JD by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers top-of-the-line DSP peripherals like this one, designed to enhance your sound performance. Whether you're a music enthusiast, a gamer, or a professional in the audio industry, this product offers unmatched value and benefits. Upgrade your system with the SN750520JD and immerse yourself in crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer high thermal conductivity and excellent electrical insulation, making them ideal for high-performance applications where heat dissipation is crucial.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into existing circuits and systems, providing a compact and space-saving solution for DSP peripherals.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DSP peripheral can withstand high levels of heat, ensuring reliable operation in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that the DSP peripheral can function effectively even in colder conditions, providing versatility and reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in interfacing with other components or systems, enabling seamless integration and communication between devices.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades, this DSP peripheral is suitable for a wide range of applications in commercial settings, ensuring compatibility with standard operating conditions.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

The DSP peripheral with pipeline register architecture provides efficient data processing and throughput, making it suitable for real-time signal processing and high-speed applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering and mounting process, ensuring secure connections and robust assembly for reliable performance in the long run.

Technical Specifications

DSP Peripherals SN750520JD attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP(UNSPEC)

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN750520JD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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