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CY29FCT520ATSOCG4

Texas Instruments

CY29FCT520ATSOCG4 by Texas Instruments

CY29FCT520ATSOCG4 by Texas Instruments is a DSP Peripheral with 8-bit Output Data Bus Width, operating at 7.14 MHz clock frequency. Ideal for industrial applications, it features low power mode and operates in temperature range of -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,832 parts In-Stock

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Digiode

USA . 1,656 parts In-Stock

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1,656

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,384 parts In-Stock

1+ parts

$2.970

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1,384

$2.970

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One Stop Electronics

USA . 228 parts In-Stock

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$5.000

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228

$5.000

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AZTECH Wire

Italy . 732 parts In-Stock

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$7.273

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732

$7.273

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Corohmni

South Africa . 706 parts In-Stock

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$67.059

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706

$67.059

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Parana Technologies

USA . 881 parts In-Stock

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$74.685

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$6,935.657

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$67.217

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881

$74.685

$6,935.657

$67.217

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DigiPath Technology Company

USA . 1,198 parts In-Stock

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$82.238

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ChromeModa Solutions

Germany . 2,625 parts In-Stock

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$83.916

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$68.811

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IDEA Electronic Components Group

UK . 968 parts In-Stock

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$83.916

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$79.720

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$75.524

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968

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Corphita

USA . 2,335 parts In-Stock

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Native Components

USA . 796 parts In-Stock

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Overview

Unlock the power of advanced signal processing with the CY29FCT520ATSOCG4 by Texas Instruments. Designed with precision and reliability in mind, this DSP peripheral offers unparalleled performance for a wide range of applications. From industrial automation to telecommunications, this versatile device delivers high-quality results with ease. Trust Texas Instruments for cutting-edge technology that delivers value and innovation to your projects. Elevate your designs with the CY29FCT520ATSOCG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.25 V

Provides a high operating voltage range for flexibility in power supply options.

Package Shape: RECTANGULAR

Facilitates easy integration into various electronic devices and circuit layouts.

Output Data Bus Width: 8

Provides a wide data bus width for efficient data transfer and processing capabilities.

Power Supplies (V): 5

Standard power supply voltage for compatibility with a wide range of electronic systems.

No. of Terminals: 24

Offers ample terminal connections for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE

Compact package style saves space and allows for high-density PCB designs.

Minimum Supply Voltage: 4.75 V

Ensures reliable performance even at lower power supply levels.

Maximum Operating Temperature: 85 °C

Allows the product to operate in a wide range of temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ensures the product can withstand extreme low-temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable terminal connections.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved signal integrity.

Maximum Seated Height: 2.65 mm

Low profile design allows for compact and slim electronic device configurations.

Width: 7.5 mm

Compact width for space-saving integration into electronic systems.

External Data Bus Width: 8

Consistent data bus width for seamless communication with other components.

Maximum Clock Frequency: 7.14 MHz

High clock frequency for fast data processing and task execution.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering processes during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature for robust soldering connections.

Length: 15.4 mm

Optimal length for versatile placement and integration in various electronic designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments and temperature fluctuations.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

Specialized DSP peripheral with pipeline register for enhanced data processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable soldering connections.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and PCB layout.

Low Power Mode: YES

Includes a low power mode for energy-efficient operation and reduced power consumption.

Technical Specifications

DSP Peripherals CY29FCT520ATSOCG4 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

7.14 MHz

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Data Bus Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

CY29FCT520ATSOCG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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