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IMSA100-G21M

STMicroelectronics

IMSA100-G21M by STMicroelectronics

IMSA100-G21M by STMicroelectronics is a military-grade DSP peripheral with a ceramic package and operates b/w -55 °C to 125 °C. It features 84 terminals, a max supply current of 360 mA, and nominal voltage of 5 V. Ideal for digital filtering applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,002 parts In-Stock

1+ parts

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1,002

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Digiode

USA . 340 parts In-Stock

1+ parts

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340

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Anansix

USA . 333 parts In-Stock

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333

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 957 parts In-Stock

1+ parts

$47.348

100+ parts

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1k+ parts

$42.613

10k+ parts

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957

$47.348

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$42.613

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MKK Technologies

India . 2,205 parts In-Stock

1+ parts

$89.034

100+ parts

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2,205

$89.034

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DigiPath Technology Company

USA . 2,205 parts In-Stock

1+ parts

$89.034

100+ parts

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2,205

$89.034

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Corphita

USA . 3,357 parts In-Stock

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3,357

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Parana Technologies

USA . 1,346 parts In-Stock

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$56.612

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1,346

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$56.612

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Overview

Experience unmatched reliability and performance with the IMSA100-G21M from STMicroelectronics. Crafted with precision, this DSP peripheral excels in demanding military applications, ensuring optimal operation in extreme temperatures. Backed by STMicroelectronics' industry-leading expertise, it offers superior quality and durability. Elevate your projects with a trusted solution that delivers robust functionality, enhances design efficiency, and guarantees long-term value for your innovative systems.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package material provides excellent thermal stability and durability, making it suitable for demanding environments.

Screening Level: 38535Q/M; 38534H; 883B

High screening levels ensure reliability and performance for military and high-reliability applications.

Package Shape: SQUARE

The square package shape allows for efficient space utilization on PCB layouts, facilitating easier integration into designs.

Power Supplies (V): 5

Operating at a standard 5V power supply makes it compatible with a wide range of systems and simplifies design considerations.

No. of Terminals: 84

With 84 terminals, this device can support numerous connections for complex functionalities, making it versatile for various applications.

Package Style (Meter): GRID ARRAY

The grid array style provides efficient thermal performance and electrical characteristics, beneficial for high-speed applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature supports usage in harsh environments, enhancing product reliability.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme low temperatures, this product is ideal for applications in challenging climates.

Terminal Finish: TIN LEAD

The tin-lead finish ensures good solderability and long-term reliability, particularly important in military applications.

Terminal Position: PERPENDICULAR

Perpendicular terminal positioning allows for efficient space management on PCBs, facilitating compact designs.

Temperature Grade: MILITARY

Designed to military specifications, this product guarantees high reliability and performance under stringent conditions.

Peripheral IC Type: DSP PERIPHERAL, DIGITAL FILTER

As a DSP peripheral, this IC is optimized for digital signal processing, making it essential for audio, telecommunications, and other signal applications.

Technology: CMOS

CMOS technology enhances power efficiency, providing low static power consumption and high integration capabilities.

Terminal Form: PIN/PEG

The pin/peg terminal form factor is conducive to reliable connections, reducing risks of signal loss.

Maximum Supply Current: 360 mA

A maximum supply current of 360 mA allows robust performance in demanding applications without risking power overload.

Nominal Supply Voltage: 5 V

Stability at a nominal 5V supply voltage contributes to predictable performance and ease of use in diverse applications.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this product is compatible with many PCB designs, ensuring ease of integration.

Technical Specifications

DSP Peripherals IMSA100-G21M attributes and parameters. Explore more DSP Peripherals devices from STMicroelectronics

Specs

JESD-30 Code:

S-XPGA-P84

JESD-609 Code:

e0

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA84,10X10

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

DSP Peripherals

Maximum Supply Current:

360 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

IMSA100-G21M Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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