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IMSA110-G20S

STMicroelectronics

IMSA110-G20S by STMicroelectronics

IMSA110-G20S by STMicroelectronics is a DSP Peripheral IC with 22-bit output data bus width, 20 MHz clock frequency, and 100 terminals. It is used in video imaging applications due to its CMOS technology, 5V nominal voltage, and commercial temperature grade suitability.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,773 parts In-Stock

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Digiode

USA . 817 parts In-Stock

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817

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Vyrian

USA . 356 parts In-Stock

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356

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Legend Electronics Inc.

USA . 33 parts In-Stock

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A2Z Electronics, Inc.

USA . 16 parts In-Stock

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Connector Distribution Corp

USA . 11 parts In-Stock

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Right Parts Inc.

USA . 11 parts In-Stock

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11

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Corel Iberica Componentes, S.L.

Spain . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 1,863 parts In-Stock

1+ parts

$54.472

100+ parts

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$49.025

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1,863

$54.472

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$49.025

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Corohmni

South Africa . 680 parts In-Stock

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$61.403

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680

$61.403

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MKK Technologies

India . 146 parts In-Stock

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$102.432

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146

$102.432

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DigiPath Technology Company

USA . 146 parts In-Stock

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$102.432

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146

$102.432

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Parana Technologies

USA . 466 parts In-Stock

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$65.130

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466

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Corphita

USA . 350 parts In-Stock

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350

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Kepictronics

USA . 154 parts In-Stock

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Assy Fe

Spain . 2 parts In-Stock

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Overview

Unlock the power of advanced DSP peripherals with the IMSA110-G20S by STMicroelectronics. Crafted with precision and expertise, this innovative product offers a seamless experience across a variety of applications in the video imaging industry. Delve into a world of high-quality performance and reliability as you explore the endless possibilities that this cutting-edge technology has to offer. Elevate your projects with the value, benefits, and advantages that only STMicroelectronics can deliver. Experience excellence like never before with the IMSA110-G20S.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making the product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

The square shape makes the product compact and easy to integrate into different designs.

Output Data Bus Width: 22

The wide data bus width enables fast data transfer speeds and efficient processing.

No. of Terminals: 100

Sufficient number of terminals for connecting to external devices and peripherals.

Minimum Supply Voltage: 4.5 V

Ensures stable operation even at lower supply voltages.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures without performance degradation.

Minimum Operating Temperature: 0 °C

Operational even at lower temperatures, suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity for stable connections.

Terminal Position: PERPENDICULAR

Perpendicular terminal position allows for easy integration and connection in various orientations.

Maximum Seated Height: 4.004 mm

Low profile design for space-saving and compact installations.

Width: 26.924 mm

Optimal width for fitting into standard electronic configurations.

External Data Bus Width: 8

Combined with the output data bus width, provides versatile data handling capabilities.

Maximum Clock Frequency: 20 MHz

High clock frequency for efficient processing and responsiveness.

Length: 26.924 mm

Balanced length to width ratio for better overall design compatibility.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications and environments.

Peripheral IC Type: DSP PERIPHERAL, VIDEO IMAGING

Specifically designed for video imaging applications, adding value and functionality to the product.

Technology: CMOS

CMOS technology offers low power consumption and high integration, enhancing overall efficiency.

Terminal Form: PIN/PEG

Versatile terminal form for easy connection and compatibility with various systems.

Maximum Supply Current: 350 mA

Adequate supply current for stable and reliable operation under load.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with most electronic systems.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy soldering and assembly.

Technical Specifications

DSP Peripherals IMSA110-G20S attributes and parameters. Explore more DSP Peripherals devices from STMicroelectronics

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

8

JESD-30 Code:

S-CPGA-P100

JESD-609 Code:

e0

Length:

26.924 mm

Low Power Mode:

NO

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

22

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

4.004 mm

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

26.924 mm

Peripheral IC Type:

Trade Compliance

IMSA110-G20S Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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