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IMSA100-Q21M

STMicroelectronics

IMSA100-Q21M by STMicroelectronics

IMSA100-Q21M by STMicroelectronics is a DSP Peripheral IC with 84 terminals, operating at -55 to 125 °C. It features a supply voltage of 5V and max current of 360mA. Ideal for military applications requiring digital filtering in CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,728 parts In-Stock

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4,728

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Digiode

USA . 3,415 parts In-Stock

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3,415

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Anansix

USA . 1,934 parts In-Stock

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1,934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 527 parts In-Stock

1+ parts

$47.241

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527

$47.241

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IDEA Electronic Components Group

UK . 1,013 parts In-Stock

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$47.547

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$42.792

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1,013

$47.547

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$42.792

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MKK Technologies

India . 1,683 parts In-Stock

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$89.408

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1,683

$89.408

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DigiPath Technology Company

USA . 1,683 parts In-Stock

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$89.408

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1,683

$89.408

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Parana Technologies

USA . 2,316 parts In-Stock

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$56.849

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2,316

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$56.849

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Corphita

USA . 720 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the IMSA100-Q21M by STMicroelectronics. As a leader in DSP peripherals, STMicroelectronics brings you a cutting-edge product that offers exceptional value and benefits. Ideal for military-grade applications, this product boasts a wide operating temperature range, high supply voltage, and robust terminal finish. Whether you're looking to enhance your digital filtering capabilities or improve overall system performance, the IMSA100-Q21M delivers top-notch quality that exceeds expectations. Elevate your projects with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body material provides good thermal conductivity and mechanical strength, ensuring reliable performance in various operating conditions.

Surface Mount: YES

Surface mountability makes it easier to integrate this product into circuit boards, saving space and simplifying assembly processes.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure the product meets stringent quality and reliability standards, making it suitable for mission-critical applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, especially when multiple components need to be placed closely together.

Power Supplies (V): 5

Operating at 5V nominal supply voltage provides compatibility with a wide range of systems and ensures consistent performance.

No. of Terminals: 84

Having 84 terminals allows for versatile connectivity and functionality, enabling the product to handle complex signal processing tasks.

Temperature Grade: MILITARY

Military-grade temperature tolerance means the product can operate reliably in extreme environmental conditions, making it suitable for rugged applications.

Peripheral IC Type: DSP PERIPHERAL, DIGITAL FILTER

Being a DSP peripheral with digital filter capabilities, this product is optimized for signal processing tasks, offering high performance and accuracy.

Technology: CMOS

CMOS technology enables low power consumption, high speed, and compatibility with various digital systems, making the product efficient and versatile.

Technical Specifications

DSP Peripherals IMSA100-Q21M attributes and parameters. Explore more DSP Peripherals devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQFP-F84

JESD-609 Code:

e0

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

QFF

Package Equivalence Code:

QFL84,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

DSP Peripherals

Maximum Supply Current:

360 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

IMSA100-Q21M Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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