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STV0300S

STMicroelectronics

STV0300S by STMicroelectronics

STV0300S by STMicroelectronics is a DSP Peripheral with 24-bit output data bus width, 3.3V power supply, and 30.3MHz max clock frequency. Ideal for applications requiring FFT processing in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,898 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,898

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Digiode

USA . 1,836 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,836

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Anansix

USA . 772 parts In-Stock

1+ parts

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772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,133 parts In-Stock

1+ parts

$14.024

100+ parts

-

1k+ parts

$12.622

10k+ parts

-

1,133

$14.024

-

$12.622

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MKK Technologies

India . 1,797 parts In-Stock

1+ parts

$26.372

100+ parts

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1k+ parts

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10k+ parts

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1,797

$26.372

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DigiPath Technology Company

USA . 1,797 parts In-Stock

1+ parts

$26.372

100+ parts

-

1k+ parts

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10k+ parts

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1,797

$26.372

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-

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Corohmni

South Africa . 5,001 parts In-Stock

1+ parts

$35.869

100+ parts

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10k+ parts

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5,001

$35.869

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Corphita

USA . 4,290 parts In-Stock

1+ parts

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4,290

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Parana Technologies

USA . 168 parts In-Stock

1+ parts

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100+ parts

$16.768

1k+ parts

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10k+ parts

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168

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$16.768

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Overview

Experience unparalleled performance and reliability with the STV0300S from STMicroelectronics. As a leader in DSP peripherals, STMicroelectronics delivers cutting-edge technology that is perfect for a wide range of applications. Whether you're looking to enhance your audio systems or improve signal processing capabilities, the STV0300S offers unmatched value and benefits. Trust STMicroelectronics to provide top-quality products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material offers excellent durability and protection for the DSP peripheral, ensuring reliable performance in various environments.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V allows for flexibility in power supply options, accommodating different system requirements.

Package Shape: SQUARE

The square package shape provides a compact form factor for easy integration into electronic devices with limited space.

Output Data Bus Width: 24

The wide output data bus width of 24 bits allows for high-speed data processing and efficient communication between the DSP peripheral and other system components.

Power Supplies (V): 3.3

The 3.3 V power supply ensures compatibility with standard voltage levels, making it easier to interface with other components in a system.

No. of Terminals: 100

The large number of terminals provide ample connectivity options, allowing for versatile integration and communication with other devices or peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers a reliable and stable connection between the DSP peripheral and the PCB, reducing the risk of signal interference or connectivity issues.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures efficient power consumption and operation, helping to optimize energy usage in the system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows the DSP peripheral to function reliably even in demanding thermal conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures the DSP peripheral can operate effectively in a wide range of environmental conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides a reliable and durable connection interface, ensuring long-lasting performance and connectivity.

Terminal Position: PERPENDICULAR

The perpendicular terminal position facilitates easy and secure connection to the PCB, simplifying the integration process and ensuring stable signal transmission.

Maximum Seated Height: 6.1 mm

The maximum seated height of 6.1 mm allows for a low-profile design, making the DSP peripheral suitable for compact electronic devices or systems.

Width: 26.92 mm

The width of 26.92 mm provides a balance between compact size and ample space for terminal connections, making the DSP peripheral versatile for different system layouts.

External Data Bus Width: 24

The wide external data bus width of 24 bits enables efficient data transfer and processing between the DSP peripheral and external devices, enhancing overall system performance.

Maximum Clock Frequency: 30.3 MHz

The high maximum clock frequency of 30.3 MHz allows for fast data processing and signal handling, making the DSP peripheral suitable for high-performance applications.

Length: 26.92 mm

The length of 26.92 mm offers a compact form factor for the DSP peripheral, allowing for easy integration into space-constrained electronic systems.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable operation across a wide temperature range, making the DSP peripheral suitable for commercial applications with varying environmental conditions.

Peripheral IC Type: DSP PERIPHERAL, FFT PROCESSOR

The DSP peripheral with FFT processor type provides advanced signal processing capabilities, making it ideal for applications requiring complex mathematical operations and data analysis.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the DSP peripheral in different system environments.

Terminal Form: PIN/PEG

The pin/peg terminal form provides a secure and stable connection interface, facilitating easy integration and reliable signal transmission between the DSP peripheral and the PCB.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures consistent and stable power supply to the DSP peripheral, maintaining reliable performance and signal integrity.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm offers sufficient spacing for terminal connections, making it easier to solder and assemble the DSP peripheral onto the PCB.

Technical Specifications

DSP Peripherals STV0300S attributes and parameters. Explore more DSP Peripherals devices from STMicroelectronics

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

30.3 MHz

External Data Bus Width:

24

JESD-30 Code:

S-CPGA-P100

JESD-609 Code:

e0

Length:

26.92 mm

Low Power Mode:

NO

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

24

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA100M,13X13

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

6.1 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

26.92 mm

Peripheral IC Type:

Trade Compliance

STV0300S Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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