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SNJ54S274J

Texas Instruments

SNJ54S274J by Texas Instruments

SNJ54S274J by Texas Instruments is a MIL-Grade DSP Peripheral IC with 20 terminals in a ceramic package. It operates b/w -55°C to 125°C, suitable for military applications. This TTL technology device features dual terminal position and is ideal for multiplier functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,890 parts In-Stock

1+ parts

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8,890

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Digiode

USA . 3,014 parts In-Stock

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3,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,377 parts In-Stock

1+ parts

$2.000

100+ parts

-

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1,377

$2.000

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AZTECH Wire

Italy . 312 parts In-Stock

1+ parts

$5.331

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312

$5.331

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Parana Technologies

USA . 2,358 parts In-Stock

1+ parts

$28.815

100+ parts

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1k+ parts

$52.173

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2,358

$28.815

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$52.173

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DigiPath Technology Company

USA . 914 parts In-Stock

1+ parts

$31.728

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914

$31.728

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ChromeModa Solutions

Germany . 5,863 parts In-Stock

1+ parts

$32.376

100+ parts

$26.548

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5,863

$32.376

$26.548

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IDEA Electronic Components Group

UK . 1,672 parts In-Stock

1+ parts

$32.376

100+ parts

$30.757

1k+ parts

$29.138

10k+ parts

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1,672

$32.376

$30.757

$29.138

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Corohmni

South Africa . 183 parts In-Stock

1+ parts

$78.929

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183

$78.929

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Corphita

USA . 657 parts In-Stock

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657

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Overview

Elevate your projects to the next level with the SNJ54S274J by Texas Instruments, a top-notch DSP peripheral that guarantees unmatched quality and reliability. Designed with precision and expertise by Texas Instruments, this product offers exceptional performance and versatility for a wide range of applications. From military-grade technology to through-hole terminal form, this DSP peripheral is a game-changer in the industry. Experience the value and benefits it brings to your work with the SNJ54S274J – the ultimate choice for all your DSP peripheral needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal and electrical insulation, making it ideal for high temperature environments and ensuring stable performance.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and quality control, meeting strict industry standards.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and space-saving PCB layout.

No. of Terminals: 20

Sufficient number of terminals for connecting to other components and peripherals in a system.

Package Style (Meter): IN-LINE

In-line package style allows for easy integration into existing systems and equipment.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for operation in cold environments without impacting performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connecting to the PCB.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme conditions and critical applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Dedicated DSP peripheral with multiplier functionality enhances computational capabilities and processing speed.

Technology: TTL

TTL technology offers high speed and low power consumption for efficient signal processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and reliable connections to the PCB, suitable for rugged environments.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility with commonly used PCB layouts and components.

Technical Specifications

DSP Peripherals SNJ54S274J attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNJ54S274J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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