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SNJ54LS384W

Texas Instruments

SNJ54LS384W by Texas Instruments

SNJ54LS384W by Texas Instruments is a DSP Peripheral IC with 16 terminals, MIL-STD screening, and TTL technology. It operates b/w -55°C to 125°C, suitable for military-grade applications requiring high-speed signal processing and multiplication capabilities. The flatpack package design with ceramic body material ensures reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,624 parts In-Stock

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6,624

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Digiode

USA . 2,279 parts In-Stock

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2,279

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 173 parts In-Stock

1+ parts

$16.000

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173

$16.000

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AZTECH Wire

Italy . 577 parts In-Stock

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$16.962

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577

$16.962

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Corohmni

South Africa . 2,088 parts In-Stock

1+ parts

$21.622

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2,088

$21.622

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Parana Technologies

USA . 289 parts In-Stock

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$72.367

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289

$72.367

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DigiPath Technology Company

USA . 382 parts In-Stock

1+ parts

$79.685

100+ parts

$73.310

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382

$79.685

$73.310

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ChromeModa Solutions

Germany . 4,463 parts In-Stock

1+ parts

$81.311

100+ parts

$66.675

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4,463

$81.311

$66.675

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IDEA Electronic Components Group

UK . 1,784 parts In-Stock

1+ parts

$81.311

100+ parts

$77.245

1k+ parts

$73.180

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1,784

$81.311

$77.245

$73.180

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Corphita

USA . 169 parts In-Stock

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169

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Overview

Enhance your electronic projects with the SNJ54LS384W by Texas Instruments, a top-tier manufacturer known for its high-quality DSP Peripherals. This versatile product offers unparalleled value and benefits, making it a must-have for a wide range of applications. With its durable ceramic body, flatpack package style, and military-grade temperature grade, this DSP Peripheral is designed to meet the most demanding requirements. Trust Texas Instruments to deliver reliable performance and innovative technology that will elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic body material provides excellent thermal conductivity and reliability, making the product suitable for military grade applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the product onto circuit boards, saving time and effort during assembly.

Screening Level: 38535Q/M;38534H;883B

The high screening level ensures that the product meets stringent quality standards and is reliable in extreme conditions, making it an ideal choice for military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular package shape helps in optimizing space on the circuit board and allows for easy integration into compact electronic devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product suitable for use in harsh environments where temperature fluctuations are common.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature enables the product to function reliably in extreme cold conditions, further expanding its range of applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

The DSP peripheral with multiplier functionality enhances the processing power and efficiency of the product, making it ideal for applications requiring complex mathematical operations.

Technology: TTL

The TTL technology offers high-speed digital signal processing capabilities, making the product suitable for real-time data processing and communication applications.

Technical Specifications

DSP Peripherals SNJ54LS384W attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

DSP Peripherals

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SNJ54LS384W Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-147-5793, 5962011475793

NIIN

011475793

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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