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SAA7192A/AA68A

NXP Semiconductors

SAA7192A/AA68A by NXP Semiconductors

SAA7192A/AA68A by NXP Semiconductors is a DSP peripheral designed for automotive applications, featuring an 8-bit output data bus and a max clock frequency of 32.26 MHz. It operates within -40 °C to 125 °C and supports supply voltages from 4.5V to 5.5V. Its compact chip carrier design ensures efficient integration in video imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,296 parts In-Stock

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Vyrian

USA . 4,168 parts In-Stock

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Anansix

USA . 1,987 parts In-Stock

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Corohmni

South Africa . 250 parts In-Stock

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$1.318

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$1.318

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One Stop Electronics

USA . 672 parts In-Stock

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$32.000

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672

$32.000

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UNI Independent Distributors

Spain . 4,746 parts In-Stock

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Corphita

USA . 1,626 parts In-Stock

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Overview

Unlock unparalleled performance with the SAA7192A/AA68A from NXP Semiconductors, a trusted leader in innovation. Designed for video imaging applications, this DSP peripheral excels in temperature resilience and energy efficiency, making it ideal for automotive solutions. Experience seamless integration and reliability that enhance your products, empower your projects, and elevate your brand's reputation—all while enjoying the superior quality only NXP can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the PCB, enabling more compact designs and efficient use of space.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in power supply options, accommodating a range of system designs.

Package Shape: SQUARE

The square package shape aids in even distribution of thermal characteristics and simplifies layout considerations.

Output Data Bus Width: 8

An 8-bit output data bus width provides compatibility with a variety of digital systems, ensuring versatility in application.

No. of Terminals: 68

The 68 terminal count provides ample connectivity options for interfacing with other components, enhancing usability in complex systems.

Package Style (Meter): CHIP CARRIER

Chip carrier style promotes easier assembly and soldering, leading to improved production efficiency.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage allows for operation in systems with lower power supply specifications, promoting energy efficiency.

Maximum Operating Temperature: 125 °C

This high operating temperature rating enables the product to be used in demanding environments, ensuring reliability in automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in extreme cold environments, making the product suitable for various applications.

Terminal Position: QUAD

Quad terminal positioning allows for better routing and connectivity on PCBs, enhancing ease of design.

Maximum Seated Height: 4.57 mm

A low seated height means more efficient use of vertical space on the board and improves compatibility with low-profile designs.

Width: 24.23 mm

This width allows for a standard layout on various PCBs, facilitating integration into existing designs.

External Data Bus Width: 8

An external data bus width of 8 allows easy connection to other components, making it useful in a wide range of applications.

Maximum Clock Frequency: 32.26 MHz

The 32.26 MHz clock frequency supports high-speed operation, making it suitable for real-time applications like video imaging.

Length: 24.23 mm

This standard length aids in reducing layout complexity while providing adequate space for thermal dissipation.

Temperature Grade: AUTOMOTIVE

Built to automotive standards, this product is rugged and reliable for use in vehicles, ensuring consistent performance.

Peripheral IC Type: DSP PERIPHERAL, VIDEO IMAGING

Designed specifically for DSP and video imaging applications, it offers optimized performance for these specialized tasks.

Technology: MOS

MOS technology provides low power consumption and high efficiency, making it ideal for battery-operated devices.

Terminal Form: J BEND

J bend terminals facilitate reliable soldering and improve mechanical stability, ensuring robust connections.

Maximum Supply Current: 165 mA

A maximum supply current of 165 mA allows for significant processing capabilities while maintaining power efficiency.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage simplifies design and ensures compatibility with many existing systems.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch allows for compact designs while ensuring reliability in electrical connections.

Technical Specifications

DSP Peripherals SAA7192A/AA68A attributes and parameters. Explore more DSP Peripherals devices from NXP Semiconductors

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

32.26 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

Low Power Mode:

NO

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Data Bus Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

165 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

SAA7192A/AA68A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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