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THCT1010-100JD

Texas Instruments

THCT1010-100JD by Texas Instruments

THCT1010-100JD by Texas Instruments is a DSP Peripheral with 35-bit output data bus width, 16-bit external data bus width, and operates at 5V. It is used in applications requiring a multiplier accumulator/summer peripheral IC type, with CMOS technology suitable for commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,565 parts In-Stock

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Digiode

USA . 1,711 parts In-Stock

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Electronic Expediters

USA . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 698 parts In-Stock

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$13.428

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One Stop Electronics

USA . 737 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 62 parts In-Stock

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$31.592

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$83.539

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62

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DigiPath Technology Company

USA . 962 parts In-Stock

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$34.787

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$32.004

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962

$34.787

$32.004

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ChromeModa Solutions

Germany . 6,628 parts In-Stock

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$35.497

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$29.108

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IDEA Electronic Components Group

UK . 2,090 parts In-Stock

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$35.497

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$33.722

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$31.947

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Corohmni

South Africa . 3,122 parts In-Stock

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$85.277

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Corphita

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Overview

Enhance your digital signal processing projects with the THCT1010-100JD by Texas Instruments. With its high-quality ceramic, metal-sealed cofired package and advanced technology, this DSP peripheral offers unparalleled performance and reliability. Ideal for a wide range of applications, from audio processing to telecommunications, this versatile component boasts a 35-bit data bus width and dual-terminal position, ensuring seamless integration into your designs. Experience the value and benefits of Texas Instruments' expertise in semiconductor manufacturing with the THCT1010-100JD.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired material provides excellent durability and reliability, making this product suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, making this product versatile.

Package Shape: RECTANGULAR

The rectangular shape makes the product easy to handle and integrate into various systems efficiently.

Output Data Bus Width: 35

The wide output data bus width of 35 enables high-speed data processing and efficient communication between components.

Power Supplies (V): 5

The 5V power supply is a standard voltage level widely available, ensuring compatibility with most systems.

No. of Terminals: 64

With 64 terminals, this product offers ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and space-saving integration in compact systems.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5V ensures efficient power consumption and extends the product's operational range.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high-temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable functionality even in cold conditions.

Terminal Position: DUAL

The dual terminal position provides added flexibility in installation and allows for secure connections.

Maximum Seated Height: 5.08 mm

The low maximum seated height of 5.08mm enables compact designs and efficient use of space in systems.

Width: 22.86 mm

The moderate width of 22.86mm offers a balance between size and functionality, making it suitable for various applications.

External Data Bus Width: 16

The 16 external data bus width facilitates smooth data transfer and communication between external devices and the product.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions typically found in commercial settings.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

The DSP peripheral with multiplier accumulator/summer functionality offers advanced processing capabilities for demanding applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption while maintaining high performance levels.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides strong and reliable connections, suitable for various mounting methods.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard, ensuring compatibility and ease of integration in most systems.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch offers convenience in connecting external components and peripherals, making this product user-friendly.

Technical Specifications

DSP Peripherals THCT1010-100JD attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

16

JESD-30 Code:

R-CDIP-T64

Low Power Mode:

NO

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

35

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP64,.9

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

22.86 mm

Trade Compliance

THCT1010-100JD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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