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THCT1010-160NM

Texas Instruments

THCT1010-160NM by Texas Instruments

THCT1010-160NM by Texas Instruments is a DSP Peripheral with 35-bit output data bus width, operating at -55 to 125 °C. It features a CMOS technology, MILITARY temperature grade, and supports MULTIPLIER ACCUMULATOR/SUMMER applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,627 parts In-Stock

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Digiode

USA . 2,163 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 480 parts In-Stock

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$13.539

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480

$13.539

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One Stop Electronics

USA . 971 parts In-Stock

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$20.000

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971

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Corohmni

South Africa . 5,069 parts In-Stock

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$44.321

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$44.321

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Parana Technologies

USA . 1,765 parts In-Stock

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$52.397

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DigiPath Technology Company

USA . 1,621 parts In-Stock

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$57.696

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$53.080

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1,621

$57.696

$53.080

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ChromeModa Solutions

Germany . 6,280 parts In-Stock

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$58.873

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$48.276

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6,280

$58.873

$48.276

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IDEA Electronic Components Group

UK . 760 parts In-Stock

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$58.873

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$55.929

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$52.986

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760

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Corphita

USA . 3,266 parts In-Stock

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Overview

Unlock the power of advanced signal processing with the THCT1010-160NM by Texas Instruments. Designed by a trusted manufacturer known for quality, this DSP peripheral offers a wide range of applications in various industries. With its high performance and reliability, this product provides exceptional value to customers seeking efficient data processing solutions. Experience the benefits of cutting-edge technology and unparalleled functionality with the THCT1010-160NM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape provides easy integration with other components and efficient use of space in a design.

Output Data Bus Width: 35

A wider output data bus width allows for faster data transfer and processing capabilities, improving the overall performance of the product.

No. of Terminals: 64

Having a high number of terminals enables the product to connect to various external components effectively, enhancing its functionality and versatility.

Package Style (Meter): IN-LINE

The in-line package style makes the product easy to mount on a circuit board, simplifying the assembly process.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage allows for efficient power consumption and operation in low-power environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions without compromising its performance.

Minimum Operating Temperature: -55 °C

The wide range of minimum operating temperature ensures the product remains functional even in extreme cold conditions.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connection options, improving the overall reliability of the product.

Width: 22.86 mm

The compact width of the product allows for space-efficient placement in a design, ideal for applications with size constraints.

External Data Bus Width: 16

The external data bus width of 16 ensures compatibility with a wide range of systems and devices for seamless data communication.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product's reliability and performance in harsh operating conditions typically found in military applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

The inclusion of a multiplier accumulator/summer in the DSP peripheral IC type enhances the product's processing capabilities for complex calculations and data manipulation tasks.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high-speed operation, making it energy-efficient and performance-oriented.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides secure connections for reliable operation in a variety of applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate the product into existing systems.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy and secure connections, facilitating quick and efficient integration of the product into a circuit design.

Technical Specifications

DSP Peripherals THCT1010-160NM attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

16

JESD-30 Code:

R-PDIP-T64

Low Power Mode:

NO

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

35

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

22.86 mm

Trade Compliance

THCT1010-160NM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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