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THCT1010-100FK

Texas Instruments

THCT1010-100FK by Texas Instruments

THCT1010-100FK by Texas Instruments is a DSP Peripheral with 35-bit output data bus width, 16-bit external data bus width, and operates at 5V. It is used in applications requiring a Multiplier Accumulator/Summer peripheral IC type, such as commercial-grade systems needing CMOS technology for signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,915 parts In-Stock

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Digiode

USA . 2,094 parts In-Stock

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2,094

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Distributors (Availability)

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AZTECH Wire

Italy . 631 parts In-Stock

1+ parts

$15.207

100+ parts

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631

$15.207

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Corohmni

South Africa . 2,618 parts In-Stock

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$30.237

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2,618

$30.237

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One Stop Electronics

USA . 274 parts In-Stock

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$35.000

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274

$35.000

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Parana Technologies

USA . 1,028 parts In-Stock

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$76.330

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1,028

$76.330

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DigiPath Technology Company

USA . 683 parts In-Stock

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$84.049

100+ parts

$77.325

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683

$84.049

$77.325

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ChromeModa Solutions

Germany . 6,988 parts In-Stock

1+ parts

$85.764

100+ parts

$70.326

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6,988

$85.764

$70.326

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IDEA Electronic Components Group

UK . 510 parts In-Stock

1+ parts

$85.764

100+ parts

$81.476

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$77.188

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510

$85.764

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$77.188

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Corphita

USA . 2,039 parts In-Stock

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Overview

Enhance your electronic designs with the THCT1010-100FK by Texas Instruments, a top-of-the-line DSP peripheral that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications in the tech world. With advanced features and cutting-edge technology, this chip carrier provides customers with superior performance and efficiency. Upgrade your projects today with the THCT1010-100FK and experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability, making this product suitable for use in various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, making this product convenient for integration into circuit boards.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can handle higher power requirements and provide stable performance.

Output Data Bus Width: 35

The wide output data bus width of 35 enhances data processing capabilities, allowing for faster and more efficient operation.

Power Supplies (V): 5

With power supplies of 5 V, this product is compatible with standard voltage levels commonly used in electronic systems.

No. of Terminals: 68

Having 68 terminals provides ample interface options, enabling connectivity with other components and peripherals in a system.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and space-saving design, making this product suitable for applications with size constraints.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V ensures compatibility with a wide range of power sources, enhancing flexibility in system design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate effectively in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in colder environments, making this product versatile and durable.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, reducing the risk of signal interference or loss in data transmission.

Maximum Seated Height: 2.03 mm

The maximum seated height of 2.03 mm allows for low-profile installation, which is beneficial for compact electronic devices or systems.

Width: 24.13 mm

With a width of 24.13 mm, this product offers a balanced size that can fit well in various electronic applications without occupying too much space.

External Data Bus Width: 16

The external data bus width of 16 facilitates seamless communication with external devices or peripherals, enhancing the product's connectivity and functionality.

Length: 24.13 mm

The length of 24.13 mm provides a compact form factor, making this product ideal for applications where space efficiency is crucial.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for temperature tolerance and reliability, ensuring consistent performance in typical operating conditions.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

As a DSP peripheral with multiplier accumulator/summer functionality, this product enhances signal processing capabilities and offers advanced computational features for digital signal applications.

Technology: CMOS

Utilizing CMOS technology, this product delivers efficient power consumption and high-speed operation, making it suitable for demanding digital signal processing tasks.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and soldering processes, increasing the product's overall reliability and ease of use.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, this product offers stable performance and compatibility with standard power sources commonly used in electronic systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides optimized spacing for secure connections and ease of integration, enhancing the product's versatility and convenience in system design.

Technical Specifications

DSP Peripherals THCT1010-100FK attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

External Data Bus Width:

16

JESD-30 Code:

S-CQCC-N68

Length:

24.13 mm

Low Power Mode:

NO

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Data Bus Width:

35

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC68,.95SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

THCT1010-100FK Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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