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ADSP-3210UG/+

Analog Devices

ADSP-3210UG/+ by Analog Devices

Analog Devices' ADSP-3210UG/+ is a MIL-grade DSP peripheral IC with CMOS technology. Featuring 100 terminals in a square ceramic package, it operates b/w -55°C to 125°C. Ideal for applications requiring high-performance signal processing and multiplication tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,094 parts In-Stock

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4,094

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Digiode

USA . 62 parts In-Stock

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62

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AZTECH Wire

Italy . 422 parts In-Stock

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$13.054

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422

$13.054

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Semicontronic

India . 641 parts In-Stock

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$15.000

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$14.625

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$14.550

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641

$15.000

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$14.550

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One Stop Electronics

USA . 1,043 parts In-Stock

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$26.000

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1,043

$26.000

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Parana Technologies

USA . 4,607 parts In-Stock

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$75.722

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$70.422

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4,607

$75.722

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$70.422

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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$81.422

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$77.351

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$81.422

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Corohmni

South Africa . 35 parts In-Stock

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$82.604

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35

$82.604

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DigiPath Technology Company

USA . 4,607 parts In-Stock

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$127.018

100+ parts

$121.938

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$121.938

4,607

$127.018

$121.938

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$121.938

Northwest PG Solutions

USA . 908 parts In-Stock

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Native Components

USA . 471 parts In-Stock

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Corphita

USA . 11 parts In-Stock

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Overview

Unleash the power of advanced signal processing with the Analog Devices ADSP-3210UG/+. Designed with precision and innovation, this DSP peripheral offers unparalleled performance and reliability for a wide range of applications. From military-grade technology to its high-quality ceramic package body material, this product exceeds expectations in every aspect. Elevate your projects with the superior capabilities of the ADSP-3210UG/+, providing unmatched value and benefits that will set you apart from the competition. Experience the difference with Analog Devices.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity and stability, making the product reliable in high-temperature environments.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board, making it ideal for compact designs.

No. of Terminals: 100

Having 100 terminals provides flexibility in connecting to various other components in a complex system.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced electrical performance and reliability, making it suitable for high-performance applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments without compromising its performance.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C makes it suitable for a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish ensures good solderability and electrical conductivity, facilitating easy integration into electronic assemblies.

Terminal Position: PERPENDICULAR

Perpendicular terminal position simplifies the assembly process and allows for easy connection to other components.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliability and performance in harsh environments, making it suitable for mission-critical applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a DSP peripheral with multiplier functionality, this product offers advanced signal processing capabilities and efficient computation for complex algorithms.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation, making the product energy-efficient and suitable for battery-powered devices.

Terminal Form: PIN/PEG

Pin/peg terminal form offers mechanical stability and ease of connection, ensuring reliable performance in varied environmental conditions.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the product is compatible with standard spacing on PCBs, allowing for easy integration into existing electronic systems.

Technical Specifications

DSP Peripherals ADSP-3210UG/+ attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

JESD-30 Code:

S-XPGA-P100

JESD-609 Code:

e0

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA100M,13X13

Package Shape:

Package Style (Meter):

GRID ARRAY

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Peripheral IC Type:

Trade Compliance

ADSP-3210UG/+ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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