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SN74LS384FN3

Texas Instruments

SN74LS384FN3 by Texas Instruments

SN74LS384FN3 by Texas Instruments is a DSP peripheral IC with 20 terminals in a square chip carrier package. Operating temperature range is 0-70°C, suitable for commercial applications. It features TTL technology and serves as a multiplier in various digital signal processing peripherals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,721 parts In-Stock

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8,721

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Digiode

USA . 3,812 parts In-Stock

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3,812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 379 parts In-Stock

1+ parts

$6.000

100+ parts

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379

$6.000

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AZTECH Wire

Italy . 726 parts In-Stock

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$11.160

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726

$11.160

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Parana Technologies

USA . 1,547 parts In-Stock

1+ parts

$23.055

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$23.696

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1,547

$23.055

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$23.696

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DigiPath Technology Company

USA . 1,698 parts In-Stock

1+ parts

$25.386

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1,698

$25.386

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ChromeModa Solutions

Germany . 6,118 parts In-Stock

1+ parts

$25.904

100+ parts

$21.241

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6,118

$25.904

$21.241

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IDEA Electronic Components Group

UK . 1,315 parts In-Stock

1+ parts

$25.904

100+ parts

$24.609

1k+ parts

$23.314

10k+ parts

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1,315

$25.904

$24.609

$23.314

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Corohmni

South Africa . 1,064 parts In-Stock

1+ parts

$34.521

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1,064

$34.521

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Corphita

USA . 3,025 parts In-Stock

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3,025

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Overview

Elevate your digital signal processing with the Texas Instruments SN74LS384FN3. This high-quality DSP peripheral offers unmatched performance and reliability, thanks to Texas Instruments' reputation for excellence in semiconductor manufacturing. Ideal for a wide range of applications, this chip carrier package is designed for ease of use and versatility. Experience the value and benefits of superior technology with the SN74LS384FN3, setting a new standard for efficiency and precision in DSP peripherals.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and heat resistance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost in manufacturing processes.

Package Shape: SQUARE

Square package shape ensures efficient use of space on the circuit board, making it suitable for compact electronic devices.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting to other components or peripherals, enabling versatility in system design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal performance and mechanical protection, ensuring stable operation of the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, the product can function reliably even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures the product can start up and operate effectively in various temperature settings.

Terminal Position: QUAD

Quad terminal position allows for easy connections and reduces the risk of errors during installation, ensuring a smooth integration process.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates the product is suitable for typical commercial applications, offering a cost-effective solution for various projects.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a DSP peripheral with multiplier capability, this product enhances signal processing efficiency and accuracy in a wide range of applications.

Technology: TTL

TTL technology provides reliable and fast signal processing, making the product ideal for applications that require high-speed digital operations.

Terminal Form: J BEND

J bend terminal form simplifies the soldering process during assembly, reducing the risk of connection issues and ensuring a secure electrical connection.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27 mm allows for precise and compact layout on the circuit board, enabling efficient signal routing and minimizing signal interference.

Technical Specifications

DSP Peripherals SN74LS384FN3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

DSP Peripherals

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

SN74LS384FN3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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