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CY29FCT520CTSOCTE4

Texas Instruments

CY29FCT520CTSOCTE4 by Texas Instruments

CY29FCT520CTSOCTE4 by Texas Instruments is a DSP Peripheral with 8-bit output data bus width, operating at a max clock frequency of 16.67 MHz. It is designed for industrial applications requiring low power mode and operates within a temperature range of -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,368 parts In-Stock

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2,368

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Digiode

USA . 929 parts In-Stock

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929

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 996 parts In-Stock

1+ parts

$1.340

100+ parts

-

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996

$1.340

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Northwest PG Solutions

USA . 1,405 parts In-Stock

1+ parts

$1.474

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1,405

$1.474

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AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$9.690

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621

$9.690

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Ampacity Inc.

Singapore . 745 parts In-Stock

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$30.000

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745

$30.000

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One Stop Electronics

USA . 1,088 parts In-Stock

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$32.000

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1,088

$32.000

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Corohmni

South Africa . 3,068 parts In-Stock

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$66.410

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3,068

$66.410

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Parana Technologies

USA . 2,034 parts In-Stock

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$71.188

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2,034

$71.188

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ChromeModa Solutions

Germany . 5,591 parts In-Stock

1+ parts

$79.987

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$65.589

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5,591

$79.987

$65.589

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IDEA Electronic Components Group

UK . 1,320 parts In-Stock

1+ parts

$79.987

100+ parts

$75.988

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$71.988

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1,320

$79.987

$75.988

$71.988

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DigiPath Technology Company

USA . 1,643 parts In-Stock

1+ parts

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$72.116

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1,643

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$72.116

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Corphita

USA . 773 parts In-Stock

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Microchip USA

USA . 111 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the CY29FCT520CTSOCTE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has crafted this DSP Peripheral with precision and care to meet the demands of modern technology. Seamlessly integrating into various applications, this product offers customers unmatched value, benefits, and advantages. Experience enhanced functionality and efficiency with the CY29FCT520CTSOCTE4, setting new standards for excellence in the field.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into PCB designs, saving space and making assembly more efficient.

Maximum Supply Voltage: 5.25 V

With a maximum supply voltage of 5.25V, this product can operate reliably within a wide voltage range, offering flexibility in various power supply configurations.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and soldering on the PCB, ensuring a secure and stable connection.

Output Data Bus Width: 8

The 8-bit output data bus width enables high-speed data transfer and processing, making the product suitable for applications requiring quick response times.

Power Supplies (V): 5

With multiple power supply options at 5V, this product can be easily integrated into existing systems without the need for additional power conversion circuits.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for interfacing with other components or peripherals, enhancing the product's versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps reduce the overall footprint of the product, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.75 V

With a minimum supply voltage of 4.75V, this product can operate efficiently even during voltage fluctuations, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to withstand harsh environmental conditions, increasing its durability and reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can operate in extreme cold environments without performance degradation.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and design, allowing for easier connection and routing of signals.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65mm helps reduce the overall profile of the product, making it suitable for slim electronic devices.

Width: 7.5 mm

The compact width of 7.5mm allows for easy integration of the product into tight spaces or densely populated PCBs.

External Data Bus Width: 8

The 8-bit external data bus width enables efficient communication with external devices or peripherals, enhancing the product's compatibility and versatility.

Maximum Clock Frequency: 16.67 MHz

The high maximum clock frequency of 16.67MHz enables fast data processing and execution, making the product suitable for high-performance applications.

Length: 15.4 mm

The compact length of 15.4mm allows for easy integration of the product into space-constrained designs, making it ideal for portable or compact devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in industrial environments with varying temperature conditions, increasing its suitability for industrial applications.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

The DSP peripheral with pipeline register offers high-speed data processing capabilities, making the product ideal for applications requiring real-time signal processing or digital signal manipulation.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high noise immunity, enhancing the product's reliability and efficiency.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during soldering, ensuring a stable electrical connection for enhanced performance.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this product can operate efficiently within standard voltage ranges, simplifying power supply design and integration.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and easy soldering of the product onto the PCB, ensuring accurate alignment and reliable electrical connections.

Low Power Mode: YES

The low power mode feature allows the product to conserve energy when operating in standby or low-power states, improving overall power efficiency and extending battery life in portable devices.

Technical Specifications

DSP Peripherals CY29FCT520CTSOCTE4 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

16.67 MHz

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Low Power Mode:

YES

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Data Bus Width:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

CY29FCT520CTSOCTE4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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