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CY29FCT520BTDMB

Texas Instruments

CY29FCT520BTDMB by Texas Instruments

CY29FCT520BTDMB by Texas Instruments is a DSP Peripheral with 8-bit Output Data Bus, operating at 5V. It has a clock frequency of 12.5 MHz and supports low power mode. Ideal for military applications due to MIL-STD-883 screening level and ceramic package material.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 8,102 parts In-Stock

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Digiode

USA . 4,432 parts In-Stock

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AZTECH Wire

Italy . 549 parts In-Stock

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$15.619

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Native Components

USA . 997 parts In-Stock

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Northwest PG Solutions

USA . 899 parts In-Stock

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One Stop Electronics

USA . 1,303 parts In-Stock

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Corohmni

South Africa . 682 parts In-Stock

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Parana Technologies

USA . 83 parts In-Stock

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ChromeModa Solutions

Germany . 6,636 parts In-Stock

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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DigiPath Technology Company

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Kepictronics

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Overview

Elevate your DSP peripherals to the next level with the CY29FCT520BTDMB by Texas Instruments. Crafted with precision using top-notch materials, this military-grade device offers unparalleled performance and reliability. Designed with a wide array of applications in mind, this product is a game-changer for industries seeking cutting-edge technology. Experience the seamless integration, enhanced efficiency, and unbeatable value that only Texas Instruments can deliver. Upgrade your systems today with the CY29FCT520BTDMB and redefine what's possible.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components of the product, ensuring reliable performance in various operating conditions.

Maximum Supply Voltage: 5.5 V

The product can handle high voltage inputs, making it suitable for use in a wide range of applications.

Screening Level: MIL-STD-883

This screening level ensures that the product meets stringent military standards for reliability and performance.

Output Data Bus Width: 8

The 8-bit output data bus allows for efficient data transfer and processing, enhancing the overall performance of the product.

Power Supplies (V): 5

The 5V power supply simplifies the power management requirements and compatibility with standard power sources.

No. of Terminals: 24

The ample number of terminals provide flexibility in connectivity options and integration with other components in a system.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration and mounting on a circuit board or system, optimizing space usage.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the product can operate reliably in challenging environments without overheating.

Minimum Operating Temperature: -55 °C

The wide temperature range of operation makes the product suitable for use in extreme cold environments, providing versatility in application.

Maximum Seated Height: 5.08 mm

The low seated height contributes to a compact design and allows for installation in space-constrained applications.

Width: 7.62 mm

The compact width of the product enables easy integration into systems with limited space, enhancing overall system design flexibility.

External Data Bus Width: 8

The 8-bit external data bus width facilitates high-speed data transfer and processing, improving overall system performance.

Maximum Clock Frequency: 12.5 MHz

The high maximum clock frequency allows for fast data processing and execution of tasks, enhancing the speed and efficiency of the product.

Length: 32.005 mm

The moderate length of the product provides a balance between compact size and functionality, making it suitable for various applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the product can withstand harsh environmental conditions and maintain reliable performance in demanding situations.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

The digital signal processing (DSP) peripheral with pipeline register design offers efficient data processing capabilities, making it ideal for applications requiring complex computations.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, ensuring efficient operation and reliability in various scenarios.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies installation and soldering processes, enhancing the ease of integration into electronic systems.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage standardizes power requirements and compatibility, making the product easy to integrate into existing systems.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection and compatibility with standard connectors, facilitating integration into various systems.

Low Power Mode: YES

The low power mode feature reduces power consumption during idle or low activity periods, enhancing energy efficiency and prolonging battery life in portable applications.

Technical Specifications

DSP Peripherals CY29FCT520BTDMB attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

12.5 MHz

External Data Bus Width:

8

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

Low Power Mode:

YES

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

CY29FCT520BTDMB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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