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CY29FCT520ATDMB

Texas Instruments

CY29FCT520ATDMB by Texas Instruments

CY29FCT520ATDMB by Texas Instruments is a DSP Peripheral with 8-bit Output Data Bus, operating at 6.25 MHz clock frequency. Ideal for military applications due to MIL-STD-883 screening level and wide temperature range from -55°C to 125°C. Package style is in-line with ceramic, glass-sealed body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,872 parts In-Stock

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Digiode

USA . 2,605 parts In-Stock

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2,605

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Electronics Depot

USA . 212 parts In-Stock

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212

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Resion

USA . 103 parts In-Stock

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Native Components

USA . 824 parts In-Stock

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$0.789

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824

$0.789

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Northwest PG Solutions

USA . 2,058 parts In-Stock

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$0.868

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AZTECH Wire

Italy . 196 parts In-Stock

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$6.178

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One Stop Electronics

USA . 1,121 parts In-Stock

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$23.000

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Parana Technologies

USA . 1,412 parts In-Stock

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$65.952

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DigiPath Technology Company

USA . 1,555 parts In-Stock

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$72.621

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$66.811

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$72.621

$66.811

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IDEA Electronic Components Group

UK . 2,098 parts In-Stock

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$74.103

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$70.398

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$66.693

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2,098

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ChromeModa Solutions

Germany . 632 parts In-Stock

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$74.103

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$60.764

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Corohmni

South Africa . 257 parts In-Stock

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$76.992

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Corphita

USA . 4,632 parts In-Stock

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Overview

Elevate your DSP peripherals with the CY29FCT520ATDMB by Texas Instruments, a product that embodies quality and reliability. Manufactured with top-notch materials and tested to MIL-STD-883 standards, this rectangular package offers a wide range of applications for your projects. With a low power mode and a maximum clock frequency of 6.25 MHz, this product provides exceptional value and benefits to customers looking for high-performance solutions. Experience the advantages of Texas Instruments technology with the CY29FCT520ATDMB.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent protection for the components inside the package, making the product durable and reliable in various environmental conditions.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input options, making the product suitable for a wide range of applications.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 ensures high reliability, quality, and performance standards, making this product ideal for critical military or aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape makes the product easy to handle, install, and integrate into various systems or PCB designs.

Output Data Bus Width: 8

Having a wide output data bus width of 8 allows for high-speed data processing and communication, enhancing the overall performance of the product.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard power sources, making it easy to power and operate the product in different environments.

No. of Terminals: 24

Having multiple terminals provides flexibility in connection options, allowing for easy integration with other devices or circuits.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for efficient use of PCB real estate, making the product suitable for compact designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources, enhancing the product's versatility.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extended periods of operation in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions, making the product suitable for outdoor or industrial applications.

Terminal Position: DUAL

The dual terminal position provides redundancy and improved signal integrity, reducing the risk of connection failures and ensuring consistent performance.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for slim and compact designs, making the product suitable for applications with space constraints.

Width: 7.62 mm

The compact width of the product enables easy integration into tight spaces or crowded PCB layouts, enhancing the product's usability in various applications.

External Data Bus Width: 8

Having a wide external data bus width of 8 enables high-speed data transfer between the product and external devices, enhancing overall system performance.

Maximum Clock Frequency: 6.25 MHz

The high maximum clock frequency allows for fast data processing and real-time operation, making the product suitable for applications that require high-speed performance.

Length: 32.005 mm

The compact length of the product enables easy installation in limited space, making it suitable for applications where size constraints are a concern.

Temperature Grade: MILITARY

Being designed for military-grade applications, the product meets stringent quality and reliability standards, ensuring consistent performance in challenging environments.

Peripheral IC Type: DSP PERIPHERAL, PIPELINE REGISTER

The use of pipeline register in the DSP peripheral allows for efficient data processing and improved system performance, making the product a reliable choice for complex computational tasks.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for energy-efficient and high-performance applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and reliable connections, making it easy to solder the product onto PCBs and ensuring long-term stability.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage standardizes power requirements, making it easy to interface the product with other components or systems without additional power adjustments.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm ensures compatibility with commonly used connectors and sockets, making it easy to integrate the product into existing systems or designs.

Low Power Mode: YES

The low power mode option allows for energy-efficient operation, prolonging battery life and reducing overall power consumption, making the product cost-effective and environmentally friendly.

Technical Specifications

DSP Peripherals CY29FCT520ATDMB attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

Boundary Scan:

NO

Maximum Clock Frequency:

6.25 MHz

External Data Bus Width:

8

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

Low Power Mode:

YES

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Sub-Category:

DSP Peripherals

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

CY29FCT520ATDMB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-449-6411, 5962014496411

NIIN

014496411

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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