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SN74ACT8836GB

Texas Instruments

SN74ACT8836GB by Texas Instruments

SN74ACT8836GB by Texas Instruments is a DSP peripheral with 156 terminals, operating at 5V. It features a CMOS technology, square ceramic package style, and operates b/w 0-70°C. Ideal for applications requiring a multiplier accumulator/summer in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,185 parts In-Stock

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4,185

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Digiode

USA . 247 parts In-Stock

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247

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DF Sales Co.

USA . 4 parts In-Stock

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4

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Distributors (Availability)

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$19.389

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216

$19.389

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One Stop Electronics

USA . 633 parts In-Stock

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$22.000

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633

$22.000

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Parana Technologies

USA . 1,063 parts In-Stock

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$30.713

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$69.282

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1,063

$30.713

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$69.282

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DigiPath Technology Company

USA . 528 parts In-Stock

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$33.819

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528

$33.819

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ChromeModa Solutions

Germany . 2,953 parts In-Stock

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$34.509

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$28.297

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2,953

$34.509

$28.297

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IDEA Electronic Components Group

UK . 516 parts In-Stock

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$34.509

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$32.784

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$31.058

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516

$34.509

$32.784

$31.058

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Corohmni

South Africa . 2,048 parts In-Stock

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$44.290

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2,048

$44.290

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Corphita

USA . 924 parts In-Stock

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924

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Overview

Enhance your digital signal processing capabilities with the SN74ACT8836GB by Texas Instruments. As a leader in innovative semiconductor solutions, Texas Instruments delivers top-notch quality and reliability. This DSP peripheral offers unparalleled performance, making it ideal for applications in telecommunications, audio processing, and more. With its advanced technology and commercial-grade temperature tolerance, this product provides exceptional value and efficiency to customers seeking high-quality components for their designs. Elevate your projects with the SN74ACT8836GB and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, ensuring efficient heat dissipation and overall product reliability.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this product compatible with many existing systems and power sources.

No. of Terminals: 156

Having a high number of terminals allows for versatile connectivity and integration with other components or systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments without compromising performance.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

Featuring multiple functions such as DSP peripheral and multiplier accumulator/summer, this product offers enhanced processing capabilities for various applications.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity, making the product energy-efficient and reliable in different operating conditions.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility and consistency in power requirements for optimal performance.

Technical Specifications

DSP Peripherals SN74ACT8836GB attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

S-XPGA-P156

No. of Terminals:

156

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

PGA156M,15X15MOD

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

SN74ACT8836GB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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