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SN7480JP4

Texas Instruments

SN7480JP4 by Texas Instruments

SN7480JP4 by Texas Instruments is a DSP peripheral IC with TTL technology. It features 14 terminals in an in-line rectangular ceramic package, operating b/w 0°C to 70°C. Ideal for commercial applications requiring dual terminal positions and multiplier functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,859 parts In-Stock

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4,859

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Digiode

USA . 2,901 parts In-Stock

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2,901

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Distributors (Availability)

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AZTECH Wire

Italy . 438 parts In-Stock

1+ parts

$12.831

100+ parts

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438

$12.831

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One Stop Electronics

USA . 430 parts In-Stock

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$17.000

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430

$17.000

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Corohmni

South Africa . 2,712 parts In-Stock

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$48.151

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2,712

$48.151

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Parana Technologies

USA . 1,897 parts In-Stock

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$54.337

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1,897

$54.337

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DigiPath Technology Company

USA . 1,388 parts In-Stock

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$59.832

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1,388

$59.832

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ChromeModa Solutions

Germany . 4,591 parts In-Stock

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$61.053

100+ parts

$50.063

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4,591

$61.053

$50.063

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IDEA Electronic Components Group

UK . 691 parts In-Stock

1+ parts

$61.053

100+ parts

$58.000

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$54.948

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691

$61.053

$58.000

$54.948

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Corphita

USA . 4,082 parts In-Stock

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4,082

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Overview

Unlock the potential of your next project with the SN7480JP4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This DSP peripheral offers endless possibilities for applications in various fields. With its advanced technology and high performance, this product provides unmatched value and benefits to customers. Experience seamless operation and superior results with the SN7480JP4.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and durability, ensuring reliable operation even under high temperatures.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into various circuit layouts and designs.

No. of Terminals: 14

Sufficient number of terminals for connecting multiple external devices and components.

Package Style (Meter): IN-LINE

In-line package style is compact and space-saving, ideal for applications with limited board space.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in demanding environments.

Minimum Operating Temperature: 0 °C

Wide range of operating temperatures allows for versatility in different operating conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections and layout.

Temperature Grade: COMMERCIAL

Commercial temperature grade suitable for standard commercial applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Designed specifically for digital signal processing applications and includes multiplier functionality for efficient calculations.

Technology: TTL

TTL technology offers high-speed and low-power consumption, ideal for DSP applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure and reliable connections to the circuit board.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy soldering and assembly in various electronic systems.

Technical Specifications

DSP Peripherals SN7480JP4 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN7480JP4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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