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SN74S274NP3

Texas Instruments

SN74S274NP3 by Texas Instruments

SN74S274NP3 by Texas Instruments is a DSP peripheral IC with 20 terminals in an in-line package. Operating temperature range of 0-70°C, suitable for commercial applications. Features TTL technology and dual terminal position for efficient signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,371 parts In-Stock

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7,371

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Digiode

USA . 2,847 parts In-Stock

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2,847

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Distributors (Availability)

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One Stop Electronics

USA . 338 parts In-Stock

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$2.000

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338

$2.000

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AZTECH Wire

Italy . 881 parts In-Stock

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$11.098

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881

$11.098

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Parana Technologies

USA . 966 parts In-Stock

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$46.236

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966

$46.236

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DigiPath Technology Company

USA . 1,441 parts In-Stock

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$50.912

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1,441

$50.912

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ChromeModa Solutions

Germany . 2,817 parts In-Stock

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$51.951

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$42.600

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2,817

$51.951

$42.600

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

1+ parts

$51.951

100+ parts

$49.353

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$46.756

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1,748

$51.951

$49.353

$46.756

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Corohmni

South Africa . 350 parts In-Stock

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$71.107

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350

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Corphita

USA . 4,812 parts In-Stock

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Overview

Enhance your digital signal processing capabilities with the SN74S274NP3 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable solutions for DSP peripherals. This rectangular package houses a powerful multiplier in an in-line style, making it ideal for a range of applications. From audio processing to telecommunications, this commercial-grade IC offers unmatched performance and efficiency. Upgrade your system today with the SN74S274NP3 and experience the difference that Texas Instruments technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices or systems, making it a versatile choice for different applications.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionalities, making the product suitable for complex circuit designs.

Package Style (Meter): IN-LINE

In-line package style saves space and simplifies the layout of the PCB, making it easier for design and manufacturing.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand elevated temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

The product can operate effectively even at low temperatures, making it suitable for a wide range of applications in different climates.

Terminal Position: DUAL

Dual terminal position allows for better connectivity and stability, reducing the risk of signal interference or loss.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard commercial applications, providing cost-effective solutions for businesses.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

DSP peripheral with multiplier capabilities enhances processing power and efficiency, making the product ideal for tasks that require computational algorithms and operations.

Technology: TTL

TTL technology ensures compatibility with various digital systems and devices, enabling seamless integration and communication within the circuit.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure and reliable connections to the PCB, reducing the risk of disconnection or signal loss during operation.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54 mm enables easy soldering and assembly, making it convenient for manufacturing and maintenance processes.

Technical Specifications

DSP Peripherals SN74S274NP3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74S274NP3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-247-5633, 5962012475633

NIIN

012475633

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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