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ADSP-1009ATN

Analog Devices

ADSP-1009ATN by Analog Devices

Analog Devices' ADSP-1009ATN is a DSP Peripheral with 27-bit output bus, operating at -55 to 125 °C. It features a CMOS technology, MILITARY grade temp rating, and 64 terminals in an IN-LINE package style. Ideal for applications requiring MULTIPLIER ACCUMULATOR/SUMMER peripherals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,400 parts In-Stock

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8,400

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Digiode

USA . 19 parts In-Stock

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19

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Semicontronic

India . 891 parts In-Stock

1+ parts

$1.000

100+ parts

$0.975

1k+ parts

$0.970

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891

$1.000

$0.975

$0.970

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Native Components

USA . 158 parts In-Stock

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$1.143

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158

$1.143

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Northwest PG Solutions

USA . 1,328 parts In-Stock

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$1.258

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$1.258

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One Stop Electronics

USA . 938 parts In-Stock

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$12.000

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938

$12.000

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AZTECH Wire

Italy . 875 parts In-Stock

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$17.147

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875

$17.147

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Parana Technologies

USA . 3,597 parts In-Stock

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$23.028

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$21.416

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3,597

$23.028

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$21.416

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IDEA Electronic Components Group

UK . 2,065 parts In-Stock

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$24.761

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$23.523

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2,065

$24.761

$23.523

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DigiPath Technology Company

USA . 3,597 parts In-Stock

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$38.627

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$37.082

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$37.082

3,597

$38.627

$37.082

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$37.082

Corohmni

South Africa . 4,904 parts In-Stock

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$63.649

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4,904

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Corphita

USA . 306 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the ADSP-1009ATN by Analog Devices. As a leader in DSP peripherals, Analog Devices delivers unparalleled quality and reliability in every product. This versatile device is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're looking to enhance your audio processing capabilities or optimize your signal processing tasks, the ADSP-1009ATN is the solution you've been searching for. Elevate your projects to the next level with Analog Devices' innovative technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, making it suitable for portable applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, giving flexibility in different operating environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs and ensures efficient use of board space.

Output Data Bus Width: 27

The wide output data bus width of 27 bits allows for fast and efficient data processing, making the product suitable for high-performance applications.

No. of Terminals: 64

The high number of terminals provides ample connectivity options, allowing for versatile integration into a system.

Package Style (Meter): IN-LINE

The in-line package style simplifies the assembly process and facilitates easy connection to other components on the circuit board.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient power consumption and reliability in operation, especially in low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures robust performance in harsh environmental conditions, making the product suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

The wide temperature range allows the product to operate reliably in both extreme cold and hot temperatures, ensuring versatility in various operating environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and reliable performance in the long run.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and easy connection to external circuitry, enhancing the product's usability.

Maximum Seated Height: 6.35 mm

The compact maximum seated height saves space on the circuit board and allows for more efficient system designs, especially in compact applications.

Width: 22.86 mm

The moderate width of the product ensures compatibility with standard board sizes and facilitates easy integration into different system configurations.

External Data Bus Width: 12

The external data bus width of 12 bits allows for efficient data transfer between the product and external components, ensuring smooth operation in data-intensive applications.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures reliable performance in rugged environments and critical applications where temperature fluctuations are common.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER

The designation as a DSP peripheral with multiplier accumulator/summer functionality indicates that the product is designed for high-speed signal processing and mathematical operations, making it ideal for digital signal processing applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it ideal for battery-operated devices and applications where signal integrity is crucial.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides mechanical stability, ensuring secure connections and long-term reliability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V offers standard voltage compatibility and ensures widespread availability of power sources, making the product easy to integrate into existing systems.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy connection to standard sockets and headers, facilitating quick and hassle-free integration into a system.

Technical Specifications

DSP Peripherals ADSP-1009ATN attributes and parameters. Explore more DSP Peripherals devices from Analog Devices

Specs

Boundary Scan:

NO

External Data Bus Width:

12

JESD-30 Code:

R-PDIP-T64

JESD-609 Code:

e0

Low Power Mode:

NO

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Data Bus Width:

27

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

6.35 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

22.86 mm

Trade Compliance

ADSP-1009ATN Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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