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SN74284N3

Texas Instruments

SN74284N3 by Texas Instruments

SN74284N3 by Texas Instruments is a DSP peripheral IC with 16 terminals in an in-line package. Operating temperature range of 0-70°C, suitable for commercial applications. Features TTL technology and serves as a multiplier in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,070 parts In-Stock

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5,070

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Digiode

USA . 279 parts In-Stock

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279

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One Stop Electronics

USA . 140 parts In-Stock

1+ parts

$3.000

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140

$3.000

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AZTECH Wire

Italy . 335 parts In-Stock

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$5.532

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335

$5.532

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Parana Technologies

USA . 120 parts In-Stock

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$47.580

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120

$47.580

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DigiPath Technology Company

USA . 1,870 parts In-Stock

1+ parts

$52.392

100+ parts

$48.200

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1,870

$52.392

$48.200

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ChromeModa Solutions

Germany . 2,582 parts In-Stock

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$53.461

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$43.838

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2,582

$53.461

$43.838

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IDEA Electronic Components Group

UK . 1,719 parts In-Stock

1+ parts

$53.461

100+ parts

$50.788

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$48.115

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1,719

$53.461

$50.788

$48.115

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Corohmni

South Africa . 87 parts In-Stock

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$71.701

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87

$71.701

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Corphita

USA . 4,558 parts In-Stock

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4,558

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Overview

Elevate your DSP design with the SN74284N3 by Texas Instruments, a premium quality multiplier designed for high-performance applications. Crafted by the industry leader in semiconductor manufacturing, this DSP peripheral offers unparalleled precision and reliability. Its versatile package style and temperature grade make it ideal for a wide range of commercial applications. Experience the value of superior technology and seamless integration with the SN74284N3, setting new standards in efficiency and innovation for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the product suitable for various environments.

Package Shape: RECTANGULAR

Allows for easy integration into existing circuit designs and layouts.

No. of Terminals: 16

Offers multiple connection options for interfacing with other devices.

Package Style (Meter): IN-LINE

Saves space during installation and ensures a neat and organized setup.

Maximum Operating Temperature: 70 °C

Suitable for operating in moderate to high-temperature conditions without compromising performance.

Minimum Operating Temperature: 0 °C

Ensures the product can function in a wide range of temperature environments.

Terminal Position: DUAL

Provides redundancy and flexibility in connecting the product to external devices.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial-grade products, ensuring reliability and compatibility.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Specifically designed for digital signal processing tasks and includes a multiplier functionality for advanced calculations.

Technology: TTL

Utilizes TTL technology for fast and efficient data processing and communication.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and connection of the product to a circuit board or other components.

Terminal Pitch: 2.54 mm

Standard pitch size for easy integration into existing setups and connections with compatible devices.

Technical Specifications

DSP Peripherals SN74284N3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74284N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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